Compact Module With Face-Mounted Electrodes
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Solution Overview
Problem
Existing module designs face challenges in achieving a low profile and high-frequency characteristics due to the need for columnar conductors, which increase size and impedance, and hinder the reduction of module size and high-frequency performance.
Innovation Solution
A module configuration with a first and second circuit board, where functional components have electrodes on both opposing faces, allowing direct electrical connection between the boards without columnar conductors, reducing the size and impedance, and utilizing Cu-M alloy for high melting point connections to prevent position shifts and solder drips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If columnar conductors are mounted on the circuit board to connect to external mother board, then electrical connection function is achieved, but the mounting area must be ensured and the module size cannot be reduced
Solution Approach 1:
The patent extracts the columnar conductor from the circuit board structure and replaces it with a wiring electrode formed directly on the circuit board. This eliminates the need for separate columnar conductor components and their mounting areas, while maintaining the electrical connection function through the integrated wiring electrode design.
Solution Approach 2:
The patent merges the electrical connection function with the circuit board structure itself by forming wiring electrodes directly on the circuit board. This integration eliminates the need for separate columnar conductor components, reducing the number of parts and the area required for mounting these conductors.
2Reliability
If the length of columnar conductor is made longer than the height of electronic component, then electrical connection to external board is achieved, but the module profile cannot be reduced
Solution Approach 1:
The patent extracts the columnar conductor component and replaces it with a wiring electrode formed on the circuit board surface. This eliminates the need for long columnar conductors that extend beyond the electronic component height, allowing the module profile to be reduced to match the component height.
Solution Approach 2:
The patent transitions from a three-dimensional columnar conductor structure extending vertically to a two-dimensional wiring electrode pattern on the circuit board surface. This dimensional change allows electrical connection without increasing the module's vertical profile.
3Reliability
If wiring electrode area and circuit board layers are increased to connect columnar conductor, then electrical connection is achieved, but the reduction in size and low profile are hindered
Solution Approach 1:
The patent applies local quality by forming wiring electrodes only in the specific areas where columnar conductors would be mounted, rather than increasing the overall circuit board area. The wiring electrodes are localized to the connection points, maintaining minimal area while achieving the electrical connection function.
4Reliability
If wiring electrode length is increased to connect columnar conductor, then electrical connection is achieved, but unnecessary impedance and parasitic components increase deteriorating high-frequency characteristics
Solution Approach 1:
The patent extracts the columnar conductor structure that caused long wiring electrode paths and replaces it with a more direct wiring electrode configuration. This reduces the length of current paths, minimizing impedance and parasitic inductance, thereby improving high-frequency characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact module with improved high-frequency characteristics by eliminating the need for columnar conductors, reducing size, and enhancing the reliability of connections, while maintaining the fixing function and protecting electronic components.
Implementation Method 1
utilizing Cu-M alloy for high melting point connections to prevent position shifts and solder drips
Data Source
AI summary
To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.