Side-Face Inserted Power Semiconductor Module
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Solution Overview
Problem
Existing electronic component packaging and mounting methods on circuit boards are inefficient in terms of space usage and ease of replacement, particularly for power semiconductor devices, as they require surface mounting and do not allow for easy detachment and reattachment.
Innovation Solution
An electronic component with a power semiconductor device embedded in a dielectric core layer is designed to be detachably inserted into a slot on a circuit board, where electrically conductive contacts on the component couple with corresponding contacts on the board, allowing for mechanical and electrical connection without surface mounting, thus saving space and facilitating easy exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If surface mounting is used for power semiconductor devices, then the devices can be mounted on the circuit board, but the space usage is inefficient and replacement is difficult
Solution Approach 1:
The patent transitions from surface mounting (2D placement on board surface) to side-face insertion (utilizing the 3D vertical dimension and lateral edges of the circuit board). This allows components to be mounted on the side faces rather than consuming valuable surface area, effectively utilizing the third dimension for component placement while enabling easy access for replacement.
Solution Approach 2:
The circuit board is segmented into multiple functional areas including side-face slots for component insertion, contact regions for electrical connection, and structural support zones. This segmentation allows independent access to individual components through side-face slots without requiring disassembly of the entire board, facilitating easy replacement while maintaining efficient space utilization.
2Reliability
If traditional mounting methods are used, then components can be fixed on the circuit board, but detachment and reattachment are not possible
Solution Approach 1:
The patent implements a dynamic mounting system where components can be inserted into and removed from side-face slots. The slot design includes contact regions that automatically establish electrical connections upon insertion, and the mechanical structure maintains reliable contact through precise geometric fitting. This dynamic capability allows components to be detached and reattached multiple times while maintaining reliable electrical connections, providing both stability and flexibility.
3Area of stationary object
If side-face insertion is implemented, then space is saved and replacement is easy, but the manufacturing process becomes more complex
Solution Approach 1:
The side-face slots and contact regions are pre-formed into the circuit board structure during the manufacturing process. The board is designed with integrated contact regions that are prepared in advance, allowing components to be simply inserted into pre-configured slots without requiring additional complex assembly steps. This preliminary preparation of mounting locations simplifies the overall manufacturing process while enabling space-efficient side-face insertion.
Data Source
AI summary
In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot.