Embedded Circuit Board Insulation Case for Heat Dissipation
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Solution Overview
Problem
The challenge in circuit board design is to reduce communication distance and wiring footprint while enhancing reliability and performance, particularly addressing heat dissipation and parasitic capacitance issues in embedded electronic components.
Innovation Solution
A method involving the embedding of electronic components, such as capacitors, within a circuit board, where an insulation case with multiple chambers is used to surround the components, and a heat-exchanging fluid is introduced to enhance heat dissipation, while the insulation case's design minimizes parasitic capacitance by isolating the heat-dissipating member from other conductive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electronic components are embedded in the circuit board to reduce communication distance and wiring footprint, then the circuit board performance and speed are improved, but heat dissipation becomes more difficult and parasitic capacitance increases
Solution Approach 1:
The insulation case is divided into multiple chambers (first chamber, second chamber, third chamber) that segment the space around the electronic component. This segmentation allows different regions to serve different functions: the first chamber accommodates the heat-dissipating member, the second chamber provides insulation, and the third chamber allows heat exchange with the external environment, thereby solving the heat dissipation problem while maintaining the embedded structure.
Solution Approach 2:
The insulation case acts as an intermediary structure between the electronic component and the surrounding environment. It introduces a heat-dissipating member that mediates the heat transfer process, conducting heat away from the electronic component through its thermal conduction properties while the insulation case material provides thermal isolation to directed heat flow efficiently.
2Speed
If electronic components are embedded in the circuit board to reduce communication distance, then the operational speed is improved, but parasitic capacitance increases affecting accuracy
Solution Approach 1:
The insulation case serves as an intermediary structure that electrically isolates the electronic component from surrounding conductive elements in the circuit board. By positioning the insulation case between the electronic component and adjacent conductors, parasitic capacitance is reduced, thereby maintaining signal accuracy while preserving the high-speed benefits of the embedded structure.
3Area of stationary object
If the footprint of wiring is reduced by embedding components, then the circuit board size is minimized, but heat dissipation and reliability are compromised
Solution Approach 1:
The insulation case is segmented into multiple chambers that allow simultaneous achievement of compact dimensions and effective heat management. The first chamber houses the heat-dissipating member close to the electronic component, the second chamber provides electrical insulation, and the third chamber facilitates heat exchange, thereby maintaining reliability in a minimized footprint.
Solution Approach 2:
The heat-dissipating member is nested within the insulation case, which itself is embedded in the circuit board. This nested arrangement allows the heat dissipation mechanism to be integrated within the existing embedded structure without increasing the overall circuit board footprint, thereby maintaining compact dimensions while improving reliability through effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability and performance of the circuit board by efficient heat dissipation and reduced parasitic capacitance, leading to enhanced operational speed and accuracy of the electronic components.
Implementation Method 1
a heat-dissipating member disposed on the inner surface of the circuit substrate and in heat-exchanging communication with the electronic component
Implementation Method 2
adding a heat-exchanging fluid into the first chamber
Data Source
AI summary
A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.