PCB Component Pin Fixing via Height-Control Jig
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Solution Overview
Problem
Conventional methods for fixing electronic component pins to circuit boards result in poor soldering effects due to uncontrollable pin distances, leading to potential damage and quality hazards from insufficient or excessive soldering.
Innovation Solution
A method involving bending treatment and stress relieving forming of pins, followed by placement in a height-controlling support jig to ensure precise positioning and soldering, using automatic wave soldering to improve solder filling and reduce manual soldering inefficiencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the electronic component is mounted on the circuit board without height control, then the mounting process is simple and fast, but the distance between the electronic component and circuit board cannot be controlled, causing pin damage and poor soldering effect
Solution Approach 1:
The pin undergoes preliminary bending treatment and stress relieving forming before mounting, and the component is pre-positioned in a height-controlling support jig that defines the exact distance from the circuit board. This preliminary preparation ensures precise positioning and prevents pin damage during subsequent soldering operations, resolving the contradiction between quick mounting and precise distance control.
2Ease of manufacture
If the pin is straight without bending treatment, then the component can be mounted quickly, but the pin may be pressed and damaged during soldering, causing poor soldering effect
Solution Approach 1:
The pin is pre-bent at a 90-degree angle and stress-relieving forming is performed before mounting. This preliminary action creates a pin configuration that can accommodate pressing forces during soldering without damage, while the height-controlling support jig maintains proper positioning. This resolves the contradiction between easy mounting and pin reliability.
3Adaptability or versatility
If manual soldering is used, then the process is flexible, but the solder filling degree of via holes cannot be confirmed, risking insufficient or excessive tin
Solution Approach 1:
The patent replaces manual soldering with automatic wave soldering, where a wave of molten solder automatically flows through the via holes. The height-controlling support jig ensures consistent positioning, and the automatic process inherently controls solder filling by the wave's physical characteristics, eliminating the uncertainty of manual soldering while maintaining process adaptability.
4Device complexity
If the pin distance is not controlled, then the mounting process is simple, but excessive or insufficient soldering occurs, causing quality hazards
Solution Approach 1:
The height-controlling support jig acts as an intermediary device between the electronic component and the circuit board. It provides a simple yet effective mechanism to maintain precise pin distance during mounting, ensuring consistent soldering quality without significantly increasing process complexity. The jig's height-controlling features guarantee proper positioning while the overall process remains straightforward.
Data Source
AI summary
A method for fixing an electronic component pin is provided, and relates to the technical field of printed circuit board assembly (PCBA), for improving the soldering effect of the electronic component in being soldered. The method includes performing bending treatment on a pin of an electronic component; performing stress relieving forming to the pin after being subjected to the bending treatment; placing the electronic component after being subjected to the stress relieving forming in a height-controlling support jig, where the distance between the electronic component and a circuit board is defined by the height-controlling support jig; mounting the height-controlling support jig, in which the electronic component is placed, in a corresponding position of the electronic component on the circuit board; and soldering the electronic component onto the circuit board.