Interposer Connectors for High-Speed Signal Integrity
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Solution Overview
Problem
Existing electronic devices face challenges in creating reliable, space-efficient, and cost-effective high-speed connectors that can handle high-frequency signals without generating electromagnetic interference, especially when integrating cables directly into devices due to manufacturing complexities and space constraints.
Innovation Solution
The development of interposer connectors with spring-like contacts and shields that provide reliable electrical connections between cable conductors and a main-logic board, using a combination of pads and spring contacts to ensure secure and efficient signal transmission while minimizing space usage and manufacturing difficulties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cable conductors are directly soldered to the main-logic board, then manufacturing cost is reduced and device complexity is simplified, but connection reliability decreases and manufacturing yield is reduced
Solution Approach 1:
The patent introduces an interposer connector as an intermediary component between the cable conductors and the main-logic board. This interposer includes first contacts that receive cable conductors and second contacts that mate with the board, thereby mediating the connection. This resolves the contradiction by providing a reliable connection interface (improving reliability) while maintaining a simple soldering process for the interposer itself (preserving ease of manufacture).
Solution Approach 2:
The patent segments the connection system into three distinct parts: the cable assembly, the interposer connector, and the main-logic board. The interposer acts as a separate module that can be manufactured and tested independently, then integrated with the board. This segmentation improves connection reliability through dedicated contact interfaces while maintaining manufacturing simplicity through modular assembly.
2Reliability
If a thick connector is used to provide reliable electrical connections, then connection reliability is improved, but device thickness increases and space efficiency is reduced
Solution Approach 1:
The patent transitions the connector design from a thick vertical profile to a thin planar structure. The interposer connector is designed as a thin circuit board with contacts arranged on its surfaces, effectively moving the connection interface into the lateral plane rather than requiring vertical thickness. This resolves the contradiction by providing reliable electrical connections through well-designed contact interfaces on a thin substrate, thus improving reliability without increasing device thickness.
3Device complexity
If high-frequency signals are transmitted without proper shielding, then device complexity is reduced and manufacturing is simplified, but electromagnetic interference is generated and signal quality deteriorates
Solution Approach 1:
The patent merges the shielding function with the interposer connector structure itself. The interposer includes a shield that is integrated into the connector assembly, combining the mechanical support, electrical connection, and electromagnetic shielding functions into a single unified component. This resolves the contradiction by providing effective EMI shielding for high-frequency signals while avoiding the need for separate, complex shielding structures, thus reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interposer connectors offer a reliable, space-efficient, and cost-effective solution for high-speed signal transmission by reducing electromagnetic interference and simplifying manufacturing processes, enhancing the user experience and reducing the risk of connection failures.
Implementation Method 1
the second contacts on the bottom of the interposer may each be formed of a plurality of small, spring-like contacts
Data Source
AI summary
High-speed interposer connectors that may be space-efficient, reliable, and may be readily manufactured. One example may provide an interposer connector that may be particularly space-efficient in a vertical direction by using an interposer to form an electrical connection between conductors and a main-logic board or other appropriate substrate. Another example may provide a reliable connection between conductors and a main-logic board by using fasteners to fix an interposer to the main-logic board. Another example may provide connectors that are well-suited to handling high-speed signals by providing a shield to at least partially cover a top of an interposer connector.