Digital Camera Module Packaging with Sealed Bonding Wires
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image sensor chip package methods are complex and costly due to intricate wire bonding, and they suffer from dust contamination that affects image quality and reliability due to exposed bonding wires and large package volumes.
Innovation Solution
A digital camera module package method using a carrier with a leadframe and conductive pieces, where an image sensor chip is mounted in a cavity, connected by wires, and sealed with an adhesive to protect the photosensitive area and bonding wires, with a transparent cover allowing light transmission and minimizing dust exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If bonding wires are exposed in the space for convenient operation, then wire connection is easier, but dust particles adhere to the cover and sidewalls and drop onto the chip, affecting image quality and reliability
Solution Approach 1:
The patent uses a transparent cover (thin film/shell) that seals the space containing the bonding wires, protecting them from dust particles while allowing light to pass through. The cover is adhered to the base via adhesive glue, creating a hermetic seal that prevents dust contamination of the image sensor chip and bonding wires, thus resolving the contradiction between operational convenience and reliability.
2Ease of operation
If a larger space is provided for wire connection operation, then wire connection is more convenient, but more dust particles adhere to the cover and sidewalls, increasing the risk of dust dropping onto the chip
Solution Approach 1:
The transparent cover acts as a protective shell that encloses the bonding wires and sealing space, preventing dust particles from adhering to external surfaces and entering the internal space. This resolves the contradiction by providing both adequate operational space and protection against dust contamination.
Solution Approach 2:
The sealing space created by the cover and base forms a protected environment that isolates the bonding wires and image sensor from the external dust-contaminated atmosphere, effectively creating a clean zone for the sensitive components.
3Ease of manufacture
If bonding wires are exposed for connection, then wire bonding can be performed, but bonding wires lack protection and may be damaged by dust particles entering the space
Solution Approach 1:
The transparent cover provides physical protection to the bonding wires while allowing the wire bonding process to be completed. The hermetic seal prevents dust particles from entering the space and damaging the wires, thus maintaining both manufacturability and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces labor and costs by simplifying the packaging process, enhances image quality and reliability by protecting the image sensor and bonding wires from dust, and minimizes dust-related errors.
Implementation Method 1
applying an adhesive means around the image sensor chip and at least partially covering all the wires; mounting a transparent cover to the carrier, the adhesive means adhering to the cover
Implementation Method 2
the base and the cover allowing one end of the conductive pieces to be exposed out therefrom; the transparent cover allowing light transmission
Data Source
AI summary
A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.