Camera Module Molding Base Flow Paths for Gap-Free Light Windows

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Solution Overview

Problem

The existing camera module manufacturing process faces issues with incomplete filling of packaging material in narrow flow passages, leading to gaps in the molding structure, deformation, and damage to leads due to high friction, as well as contamination of the photosensitive region, which affects the imaging quality and assembly stability.

Innovation Solution

A method involving a molding die with diversion grooves and filling grooves designed to increase the volume of the molding material flow, preventing the material from entering the photosensitive region and ensuring complete filling and structural integrity, while also providing a larger mounting surface for optical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the flow passages are made narrow to reduce the molding cavity size, then the packaging material flow velocity increases, but the friction between the packaging material and flow passage walls increases causing incomplete filling and gaps

Engineering Contradiction:
Improvemolding cavity sizeVSAvoidfilling completeness
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The flow passage is segmented into a first flow passage and a second flow passage that are connected in parallel. This segmentation allows the packaging material to flow through multiple pathways simultaneously, increasing the total flow capacity while maintaining narrow individual passage dimensions, thus resolving the contradiction between compact molding cavity size and complete filling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single linear flow passage to a two-dimensional network of flow passages by introducing parallel first and second flow passages. This dimensional expansion increases the flow cross-sectional area without significantly increasing the overall molding cavity footprint, enabling complete filling while maintaining compact size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the packaging material flows quickly to fill the molding cavity, then the molding time is reduced, but the friction causes deformation and damage to the leads

Engineering Contradiction:
Improvemolding speedVSAvoidlead integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

By dividing the flow passage into parallel first and second flow passages, the packaging material flow is distributed across multiple pathways. This reduces the flow velocity and friction in each individual passage compared to a single narrow passage, preventing lead deformation and damage while maintaining efficient molding speed through parallel flow paths.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The parallel flow passage structure acts as an intermediary that mediates between the conflicting requirements of high molding speed and lead protection. It allows rapid filling by providing multiple flow channels while simultaneously protecting the leads by distributing the flow stress across multiple pathways rather than concentrating it in a single narrow passage.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the packaging material is pressed strongly to ensure complete filling, then the filling completeness improves, but the photosensitive region becomes contaminated

Engineering Contradiction:
Improvefilling completenessVSAvoidphotosensitive region contamination
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The segmented flow passage structure with parallel first and second flow passages enables the packaging material to reach all areas of the molding cavity including the photosensitive region through distributed flow paths. This segmentation allows complete filling without requiring excessive pressing force, as the parallel pathways efficiently guide the material to all destinations including previously hard-to-reach areas.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a complete, gap-free molding structure, reduces the risk of lead damage, and enhances the imaging quality by preventing contamination of the photosensitive region, thereby improving the assembly's stability and performance.

Implementation Method 1

a fluid-like packaging material 4 flows forward along with the two flow passages 103 and 104, and fills into the intermediate flow passage 106

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 2

the packaging material 4 is cured, the packaging portion 1 can be formed

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Implementation Method 3

The upper die 101 and the lower die 102 are clamped to form a molding cavity, so that the upper die 101 is pressed on the circuit board jointed panel

Methodology Applied
Scientific EffectPressure application: Pressure Increase

Implementation Method 4

the friction generated by the inner wall of the flow passage 103 on the fluid-like packaging material 4 in it has a relatively large effect on flow velocity

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS11881491B2Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
Publication Date: 2024.01.23 NINGBO SUNNY OPOTECH CO LTD
  • US11881491B2 patent drawing
  • US11881491B2 patent drawing
  • US11881491B2 patent drawing

AI summary

Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.