Camera Module Assembly With Partially Occluded Throughbores for Solder Flow
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Solution Overview
Problem
Existing camera unit assembly methods face challenges in achieving robust and efficient alignment and soldering of lens holder and circuit board modules due to limited solder material, restricted soldering energy, and operational space constraints.
Innovation Solution
Incorporating partially occluded throughbores in the lens holder module to accommodate solder balls, allowing them to melt and flow onto the circuit board pads, forming a secure solder joint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pins are used to attach the lens holder to the circuit board, then alignment is achieved, but the volume in the aperture is limited resulting in insufficient solder material
Solution Approach 1:
The throughbore is segmented into different sections with varying occlusion levels. The upper portion remains open to receive solder ball, while the lower portion is partially occluded to contain and redirect solder material onto the pad, effectively dividing the aperture space to serve multiple functions
Solution Approach 2:
The solution transitions from a two-dimensional pin attachment to a three-dimensional throughbore structure with internal occlusion. This adds a vertical dimension to solder material containment, allowing solder to be directed from the upper aperture through the occluded section onto the pad below
2Volume of moving object
If the gap between circuit board and lens holder is very small, then compact design is achieved, but the soldering energy importing angle is limited
Solution Approach 1:
The partially occluded throughbore acts as an intermediary structure between the solder ball and the pad. It provides a controlled pathway that concentrates and redirects soldering energy, mediating the energy transfer despite the small gap between components
3Manufacturing precision
If pins must be well-aligned with apertures before insertion, then precise positioning is achieved, but operation space is limited
Solution Approach 1:
Instead of inserting pins through apertures from one side, the throughbore structure allows solder ball to be introduced from the upper aperture and redirected through the occluded section onto the pad below, inverting the traditional assembly sequence and providing greater operational flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the mechanical strength and reliability of the camera unit assembly by ensuring a robust solder joint, while maintaining a compact design.
Implementation Method 1
soldering energy can be imparted to the solder ball to melt and at least partially flow from the bottom of the throughbore and onto a pad of the circuit board
Data Source
AI summary
A camera unit assembly which improves efficiency and quality of the soldering affixing lens holder and circuit board modules by providing partially occluded throughbores within a mounting part of the lens holder module, which can accommodate a solder ball, and into which soldering energy can be imparted allowing the solder ball to melt and at least partially flow from the bottom of the throughbore and onto a pad of the circuit board.