Camera Module PCB Layout for OIS Connection Reliability

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Solution Overview

Problem

Conventional voice coil motor technology is difficult to apply to micro-scale camera devices requiring low power consumption, and there is a need for improved insulation, solderability, and reliable electrical connections in camera devices, especially in small, multifunctional cellular phone cameras.

Innovation Solution

A camera device with a fixed and moving unit, featuring a second circuit board with conductive and insulating layers, and a support member made of injection-molded non-conductive material to ensure reliable electrical connections and resistance to external impact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the lower surface of the first region is located higher than the first conductive layer, then insulation is improved and solderability is enhanced, but the structural complexity increases

Engineering Contradiction:
Improveinsulation and electrical connection reliabilityVSAvoidcircuit board structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The second circuit board is divided into a first region (terminal region) and a second region, with the first region's lower surface positioned higher than the first conductive layer. This segmentation allows the terminal region to have improved insulation and solderability while maintaining electrical connection reliability, resolving the contradiction between reliability improvement and structural complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a vertical height difference in the Z-direction between the lower surface of the first region and the first conductive layer. This dimensional change creates an insulating gap that improves both insulation performance and solderability without requiring additional insulating materials or complex routing, thus improving reliability while minimizing added complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If a support member is used to support the moving unit, then reliability under external impact is improved, but the device complexity increases

Engineering Contradiction:
Improveresistance to external impact and OIS operation stressVSAvoidsupport structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The support member is constructed as a composite structure combining a first support portion and a second support portion with different functions. The first support portion provides mechanical support while the second support portion provides electrical connection, creating a multi-functional component that improves reliability under external impact and OIS operation without proportionally increasing device complexity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The support member serves multiple functions simultaneously: it provides mechanical support for the moving unit, maintains electrical connections between circuit boards, and resists external impact forces. This multi-functionality improves reliability while minimizing the increase in device complexity by consolidating multiple functions into a single component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12526500B2Camera device and optical instrument
Publication Date: 2026.01.13 LG INNOTEK CO LTD
  • US12526500B2 patent drawing
  • US12526500B2 patent drawing
  • US12526500B2 patent drawing

AI summary

A camera device of the disclosure includes a fixed unit and a moving unit, which includes a first circuit board, a second circuit board disposed under the first circuit board, and an image sensor and which is movable relative to the fixed unit in a direction perpendicular to an optical-axis direction. The second circuit board includes a plurality of conductive layers including a first conductive layer and a plurality of insulating layers including a first insulating layer. The first insulating layer is the lowermost layer of the second circuit board, and the first conductive layer is disposed on the first insulating layer. The second circuit board includes a first region coupled to the first circuit board using a solder, and the lower surface of the first region is located higher than the first conductive layer.