Printed Circuit Aspects TRIZ Cases

Multiple thermal paths in the PCB move DSP heat to the lower shell, improving optical module stability in high-temperature use.

Tuned support film roughness improves fine PCB resist sidewall smoothness while reducing film scratches during photosensitive element production.

A layered carrier stack enables galvanically isolated conductor coupling without solder or conductive adhesive, cutting film assembly cost and time.

An etched neck links the back drill hole to the via end, cutting parasitic stubs and burrs for stable high-frequency signals up to 100 GHz.

A surface current bridge expands PCB power regions to carry higher current with lower resistance and voltage drop without adding layers.

Segmented electrodes and floating dummy patterns improve ACF heat and pressure transfer, enabling reliable bonding in miniaturized strain gauges.

Openings in waste substrate areas relieve cutting stress near board edges, preventing cracks and solder peeling in functional modules.

A stepped second PCB and multifunction support member improve insulation, solderability, and stable OIS electrical connections under impact.

Smaller filler grains in the upper insulating layer help fill fine interconnect gaps, improve adhesion, and prevent cracks and disconnections.

A gradient layer bonds moisture-barrier and hard protective layers on PCBs, preventing delamination while resisting wear and moisture.

Segmented connection wiring with holes relieves thermal stress and blocks plating solution penetration to prevent peeling and copper corrosion.

Vertical vias link insulated metal sections across PCB layers to simplify dense LED routing while improving heat dissipation.

A cavity heat-dissipating portion extends through the PCB sidewall to spread component heat while preserving mounting space and reducing warpage.

Combines UV sanitizing, air drying, charging ports, and accessory storage in one helmet mount to reduce clutter and improve hygiene.

A segmented resin-metal alignment mark limits laser-induced filler aggregation, improving CCD reading accuracy in multilayer wiring boards.

Segmenting a via into overlapping sub vias lowers filling difficulty and wire breakage risk while maintaining stable electrical connections.

A recessed conductive structure with a surrounding diffusion barrier blocks copper migration at short pitches while avoiding costly CMP.

Boron-containing oxide dispersed in polyimide lowers thermal expansion to reduce warpage and peeling while preserving transparency and heat resistance.

A double-resin HRM PTC ink for flexible heaters suppresses NTC behavior and sharpens resistance switching for safer temperature regulation.

Valve-controlled coolant bypass throttles board cooling so IC chips reach target temperature faster without added heaters or unstable power supply cooling.

Separating curved display PCBs and varying chip-on-film connections spreads deformation stress and helps prevent PCB and COF damage.

Narrow wiring sections are made thicker to preserve cross-sectional area, stabilize resistance, and reduce disconnection risk.

A bonded conductive-trace board replaces grooved sensing wires in flat plate calorimeters, cutting fabrication cost and enabling curved-surface measurement.

A plated metal frame wraps the glass panel edges to prevent chipping, self-align assembly, and enable standard handling tools.

A shaped cable hole cover holds foldable-device cables in place to prevent layer separation, adhesive gaps, and water ingress.

Controlled edge spacing and insulating-layer overlap suppress solder flow toward the metal support, reducing short-circuit risk in compact boards.

Copper-filled PCB trenches and buried vias increase cross-sectional area to cut DC resistance and improve high-current power delivery.

Reinforcement encapsulants, reverse-profile vias, and dummy interconnections reduce CTE-driven warpage so multilayer redistribution structures stay processable.

Liquid metal composites shield embedded traces in a flexible circuit board, preserving high-frequency signal integrity during repeated bending.

A held torsion spring arm enables stable PCB-to-image-forming-unit contact from multiple mounting directions while saving space.

A rigid insulated carrier sheet with metal pillars and a buffering layer improves flatness, thermal stability, and crack resistance during handling.

A catalyst-tuned cyclic olefin copolymer varnish stays soluble and fluid at high solid content, enabling stable fiber impregnation for circuit boards.

A copper oxide surface and nitrogen-based adhesive strengthen PCB resin bonding, preventing peeling while keeping high-speed signal loss and noise low.

A secondary PCB moves CAMM memory below the main card, preserving processor area while enabling wider heat sinks and better airflow.

Segmented ceramic plates, metal pillars, and resin layers reduce carrier warpage from CTE mismatch, improving large-area packaging yield and stability.

Different insulating materials around a framed glass layer create compressive stress that limits cracking, fracture, and warpage during PCB processing.

A through hole, blind hole, and connection groove route electrolyte for plating deep vias in thick multilayer PCBs, improving signal transmission.

A detachable holder and rib fix source PCBs and cables of varying sizes without redesign, reducing damage risk and display thickness.

Through holes placed in a metal region stabilize LED module screw fixing, while insulated separation improves attachment safety.

Closed-loop liquid thermal shock units speed temperature transitions for electronic component testing while reducing chamber size and cost.

Galvanic connection stacks link embedded components through the layer body, simplifying interconnects while improving heat removal and reliability.

Multiple frame fixing portions secure the control board in compact display modules, limiting vibration damage, heat deformation, and moisture ingress.

Coverlay and through holes reduce FPC warping and lamination bubbles, improving magnetic layer fit and antenna performance.

Partially embedded conductive balls in a flexible PCB maintain reliable fine-pitch display panel connections without separate conductive adhesives.

A recessed base, rubber pad, heat sink, and vents protect the camera circuit board from moisture and impact while dissipating heat.

Separate sensor and processing boards with damping and press structures protect inertial sensors from thermal stress, vibration, and shock in tight spaces.

A reflective layer and molded diffusion structure help micro LED modules improve process control and reduce center light concentration.

A PCB blackbody source with resistive heating and thermal conduction improves thermal camera calibration near human body temperature.

A stepped wiring layer lowers electrical resistance while anchoring the cover insulating layer to suppress peeling at the wiring edges.

An integrated PCB detection electrode monitors leakage current on vehicle conductor tracks to protect braking and steering circuits.