Redistribution Structure Reinforcement for Warpage Reduction
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Solution Overview
Problem
The mismatch of coefficient of thermal expansion (CTE) among different materials in electronic devices with redistribution structures leads to significant warpage, preventing the intermediate structure from being placed in manufacturing equipment.
Innovation Solution
Incorporating a first and second reinforcement, such as encapsulants, and employing conductive vias with reverse profiles to reduce warpage, along with dummy structures and interconnections to enhance rigidity, allowing the structure to be processed effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a redistribution structure with multiple dielectric layers is utilized to meet electrical properties, then electrical properties (low resistance and inductance) are improved, but warpage increases due to CTE mismatch among different materials
Solution Approach 1:
The patent modifies the physical and chemical parameters of the intermediate structure by incorporating reinforcement materials with specific mechanical properties and controlling the composition of dielectric layers. This changes the overall structural parameters to reduce CTE mismatch effects and minimize warpage while preserving electrical performance
Solution Approach 2:
The patent creates a composite intermediate structure by combining redistribution layers with reinforcement materials (such as ceramic substrates or metal cores) that have complementary properties. This composite approach balances the CTE across different materials, reducing warpage while maintaining the required electrical characteristics through the conductive pathways in the redistribution structure
2Reliability
If a redistribution structure with multiple dielectric layers is utilized, then electrical properties are improved, but the intermediate structure cannot be placed in manufacturing equipment due to warpage
Solution Approach 1:
The patent adjusts structural parameters by adding reinforcement elements that modify the mechanical stability of the intermediate structure. This enables the structure to meet manufacturing equipment requirements for flatness and dimensional control while maintaining the multi-layer redistribution design needed for electrical performance
Solution Approach 2:
The reinforcement material acts as an intermediary component between the dielectric layers and the manufacturing process. It provides a stable substrate that facilitates handling and processing in manufacturing equipment, while the redistribution structure built upon it maintains the required electrical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warpage, enabling the electronic device to be integrated into manufacturing equipment and facilitates the placement of multiple functional IC devices on opposite surfaces.
Implementation Method 1
a first reinforcement supporting the first redistribution structure; forming a second redistribution structure over the first redistribution structure
Data Source
AI summary
The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a first redistribution structure and a first encapsulant. The first encapsulant supports the first redistribution structure and is configured to function as a first reinforcement to provide a second redistribution structure. The redistribution structure has a plurality of conductive layers disposed over the first redistribution structure.