Plated Glass Panel Frame for Damage-Resistant Handling
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Solution Overview
Problem
Glass substrates are fragile and prone to damage during handling and processing, requiring specialized toolsets that are not widely available, and the transition to glass core processing in high-volume manufacturing is costly.
Innovation Solution
An in-situ frame assembly process where a metallic frame is directly plated onto the glass substrate, ensuring perfect alignment and eliminating the need for separate frame components, overmolding materials, and manual placement, with the frame wrapping around the substrate for improved adhesion and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass substrates are used to improve mechanical robustness and electrical performance, then substrate strength and electrical performance are improved, but the substrates become extremely vulnerable to damage during handling and processing
Solution Approach 1:
A frame structure is formed around the perimeter of the glass substrate before final processing steps. This frame acts as a protective cushion that absorbs mechanical stresses and prevents direct contact with the fragile glass edges during handling and subsequent processing operations, thereby maintaining both the strength benefits of glass and the reliability needed for manufacturing
Solution Approach 2:
The frame serves as an intermediary element between the glass substrate and the handling/processing environment. It mediates the mechanical interactions by providing a robust interface for toolsets while protecting the glass substrate from direct contact and damage, enabling standard manufacturing tools to work with glass substrates without specialized modifications
2Reliability
If specialized toolsets are designed to handle glass panels, then handling reliability is improved, but technology improvement cost increases significantly
Solution Approach 1:
The frame structure provides multiple functions: it protects the glass substrate during handling, enables compatibility with standard manufacturing toolsets, and serves as an interface for subsequent processing steps. This multi-functionality eliminates the need for specialized glass-handling toolsets, allowing existing manufacturing equipment to be used without significant modification or investment
3Strength
If a frame is separately manufactured and manually placed on the glass substrate, then frame adhesion is improved, but manufacturing complexity and time increase
Solution Approach 1:
The frame formation process is merged with the substrate processing steps. The frame is formed in-situ around the glass substrate perimeter through a integrated process sequence that combines substrate preparation and frame formation, eliminating separate manufacturing and assembly steps while maintaining strong adhesion between the frame and substrate
4Manufacturing precision
If manual placement of frame components is used, then positioning precision is improved, but productivity decreases
Solution Approach 1:
The frame structure is formed to self-align with the glass substrate through geometric constraints and registration features built into the process. The frame formation process automatically positions itself relative to the substrate without requiring manual placement or complex alignment procedures, achieving both high precision and high throughput through automated self-positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the mechanical robustness of glass substrates by preventing misalignment and chipping, reduces assembly costs, and maintains thickness uniformity, facilitating efficient integration into electronic packaging.
Implementation Method 1
a frame around a perimeter of the substrate, wherein the frame is over a top surface, a bottom surface, and a sidewall surface of the substrate
Data Source
AI summary
Embodiments disclosed herein include an apparatus that comprises a substrate. In an embodiment, the substrate comprises a glass layer. In an embodiment, a frame is provided around a perimeter of the substrate. In an embodiment, the frame is over a top surface, a bottom surface, and a sidewall surface of the substrate. In an embodiment, the frame comprises a conductive material.


