Multi-Pattern Substrate Openings to Protect Edge-Mounted Components

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Solution Overview

Problem

Existing methods for producing functional modules with components near the edge of a small printed substrate result in stress-induced cracks and reduced productivity due to bending during cutting, particularly affecting components like inductors and shielding cases.

Innovation Solution

A multi-pattern substrate design with waste substrate parts around the wiring substrate parts, featuring openings in areas facing components, to mitigate stress and prevent cracking during cutting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a component is arranged near the edge of the small printed substrate to meet functional requirements, then the functionality of the functional module is improved, but stress due to bending in cutting out the substrate causes cracks in the component or solder, reducing productivity

Engineering Contradiction:

Improvecomponent arrangement flexibilityVSAvoidyield

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The substrate is divided into multiple small printed substrates arranged in a matrix pattern, with each substrate containing components. This segmentation allows the cutting process to be distributed across multiple smaller units rather than one large unit, reducing the bending stress on individual components during cutting while maintaining the overall functional requirements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A buffer layer is introduced between the substrate and the component near the edge. This buffer layer acts as an intermediary that absorbs and distributes the stress generated during cutting, preventing direct transmission of bending forces to the component and solder, thereby preventing cracks while maintaining component functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If a large printed substrate is partitioned into multiple sections and cut off along parting lines, then the production efficiency is improved, but bending during cutting causes stress concentration at edge areas, leading to cracks

Engineering Contradiction:

Improveproduction efficiencyVSAvoidcomponent integrity

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The buffer layer is selectively positioned only at the edge areas where components are located, rather than uniformly across the entire substrate. This local application provides stress protection exactly where needed during cutting, while maintaining the overall cutting efficiency and not adding unnecessary material to non-critical areas.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The buffer layer is pre-installed on the substrate before the cutting process. This beforehand cushioning measure ensures that when cutting occurs, the stress is already mitigated by the buffer layer, preventing cracks before they can form. This is more effective than post-cutting reinforcement methods.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS12526926B2Multi-pattern substrate, functional module, and production method for functional module

Publication Date: 2026.01.13 CANON KK

AI summary

A technique that improves productivity of a functional module on which a component is implemented near an edge. A multi-pattern substrate includes wiring substrate parts, and waste substrate parts provided around the wiring substrate parts integrally. And openings are provided in the waste substrate parts in areas that face components implemented near outer circumferences of the wiring substrate parts.