Coolant Flow Bypass Control for Rapid IC Chip Warm-Up
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Solution Overview
Problem
Existing liquid cooling systems for electronic devices inhibit performance by slowly warming up specialized circuit systems to optimal operating temperatures due to continuous heat dissipation, leading to increased costs and complexity with the use of dedicated heaters.
Innovation Solution
A circuit system with a controller that adjusts coolant flow rates through conduits using valves to selectively throttle cooling, allowing the system to quickly reach elevated target temperatures, optimizing performance by controlling the temperature of integrated circuit chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If continuous coolant flow is maintained to cool electronic devices, then cooling effectiveness is improved, but the system cannot reach optimal operating temperatures quickly, leading to reduced performance
Solution Approach 1:
The patent applies dynamics by making the coolant flow rate adjustable rather than fixed. The system transitions from continuous high-flow cooling to reduced-flow or interrupted cooling based on operational requirements, allowing rapid temperature changes to match varying computational loads and reach optimal operating temperatures quickly.
Solution Approach 2:
The patent changes the parameter of coolant flow rate dynamically. By adjusting the flow rate from high to low or from continuous to intermittent based on real-time temperature sensors and computational workload, the system can rapidly heat up to optimal temperatures when needed while maintaining cooling capability when required.
2Temperature
If dedicated heaters are added to warm the system to optimal temperatures, then heating capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent applies self-service by using the electronic devices' own operational heat generation to warm themselves to optimal temperatures. Instead of adding external heaters, the system reduces or interrupts coolant flow during low-utilization periods, allowing the devices to self-heat through their normal operation, thereby eliminating the need for dedicated heating components.
3Speed
If coolant flow is throttled to enable rapid heating, then temperature adjustment speed is improved, but cooling capability deteriorates
Solution Approach 1:
The patent applies periodic action by intermittently adjusting coolant flow based on real-time monitoring of device temperature and computational workload. The system alternates between reduced-flow periods (allowing heating) and high-flow periods (providing cooling), creating a dynamic balance that enables rapid temperature adjustment while maintaining overall cooling effectiveness.
4Temperature
If high coolant flow rate is maintained, then cooling effectiveness is improved, but energy consumption increases
Solution Approach 1:
The patent applies partial action by providing full coolant flow only when actually needed for cooling, rather than maintaining constant high flow. During low-utilization or warm-up periods, the system reduces coolant flow to minimal levels, consuming energy only to the extent necessary for temperature management, thereby reducing overall energy consumption while maintaining cooling effectiveness when required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid heating of circuit systems to optimal operating temperatures, improving performance and reducing costs and complexity by selectively throttling coolant flow, while maintaining stable power supply cooling.
Implementation Method 1
a first conduit configured to convey a first flow of a coolant, wherein the first conduit is arranged such that the first flow of the coolant through the first conduit cools the circuit board
Implementation Method 2
a flow restrictor configured to restrict the second flow of the coolant through the second conduit
Data Source
AI summary
A circuit system includes: a plurality of integrated circuit (IC) chips on a circuit board; a first conduit configured to convey a first flow of a coolant, wherein the first conduit is arranged such that the first flow of the coolant through the first conduit cools the circuit board; a second conduit configured to convey a second flow of the coolant from a common inlet with the first conduit, wherein the second flow bypasses the first conduit; a valve configured to adjust a relative degree of flow of the coolant between the first conduit and the second conduit; and a controller configured to, based at least on data characterizing operation of the plurality of IC chips, control the valve to adjust a first flow rate of the coolant through the first conduit.