Wiring Substrate Layout With Screw Holes for Stable LED Module Fixing

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Solution Overview

Problem

Existing wiring substrates lack stability and safety in their fixed state when attached to other members, necessitating improvements in fixation methods.

Innovation Solution

A wiring substrate design featuring a metal portion, electrode portion, and insulating portion, with defined through holes for screw fixation, ensuring separation of regions for enhanced stability and safety.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If through holes are formed in the mounting substrate for screwing, then the fixation stability is improved, but the structural complexity increases

Engineering Contradiction:
Improvefixation stabilityVSAvoidstructural complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The mounting substrate is divided into distinct functional regions: a first region with metal portions for mechanical fixation, a second region with electrode portions for electrical connection, and a third region with insulating portions for separation. This segmentation allows through holes to be strategically placed only in the metal region, providing fixation stability while maintaining clear functional separation and reducing overall structural complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the mounting substrate are assigned different material properties and functions: the metal region provides mechanical strength for screw fixation, the electrode region provides electrical conductivity for power supply, and the insulating region provides electrical isolation. This local differentiation optimizes each region for its specific purpose, improving fixation stability without unnecessarily complicating the entire structure.

Inventive Principle:
Principle #3Local quality

2Reliability

If the metal portion and electrode portion are separated by the insulating portion, then the safety is improved, but the manufacturing complexity increases

Engineering Contradiction:
ImprovesafetyVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The substrate structure is segmented into metal portions, electrode portions, and insulating portions arranged in alternating regions. The insulating portions are positioned between metal and electrode regions to provide electrical isolation, ensuring safety while maintaining a systematic manufacturing approach where each region can be processed independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The insulating portions serve as intermediary elements that physically and electrically separate the metal portions from the electrode portions. This intermediary structure prevents direct contact between conductive elements, improving safety by preventing short circuits, while the insulating material itself can be integrated into the manufacturing process as a standard layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12513824B2Light-emitting module, method of manufacturing wiring substrate, and method of manufacturing light-emitting module
Publication Date: 2025.12.30 NICHIA CORP
  • US12513824B2 patent drawing
  • US12513824B2 patent drawing
  • US12513824B2 patent drawing

AI summary

A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.