Micro LED Light Module With Reflective Diffusion for Image Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro LEDs in display devices face challenges in process control efficiency and image imbalance due to their small size, making it difficult to mount them directly on a display panel and causing light concentration at the center, leading to image imbalance.
Innovation Solution
A light emitting device module comprising a circuit board, a semiconductor light emitting device, a reflective layer with an opening, a molding layer, and optionally a diffusion pattern layer, which includes a heat-resistant layer and a light diffusion layer to improve process efficiency and control image imbalance by guiding and diffusing light effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If micro LEDs are directly mounted on a display panel, then the display device can be realized, but process control efficiency deteriorates due to the small size of micro LEDs
Solution Approach 1:
The patent introduces a circuit board as an intermediary substrate between the micro LEDs and the display panel. The micro LEDs are mounted on the circuit board first, and then the assembled module is mounted on the display panel. This intermediary approach allows for easier process control during manufacturing while maintaining the small size benefits of micro LEDs.
Solution Approach 2:
The patent divides the display device into separate modules: a circuit board module containing the micro LEDs and a display panel module. This segmentation allows the micro LEDs to be manufactured and tested independently on the circuit board before final assembly, improving process control efficiency without compromising the small size advantage.
2Ease of operation
If micro LEDs are arrayed on a two-dimensional plane to correspond to each sub-pixel, then a micro LED display can be realized, but image imbalance occurs due to light concentration at the center
Solution Approach 1:
The patent applies a diffusion pattern layer with spatially varying properties to different regions of the circuit board. The diffusion pattern is designed to be stronger at the center and weaker at the edges, creating local quality variations that compensate for the natural light concentration at the center, thereby achieving uniform image output across the entire display area.
Solution Approach 2:
The patent changes the optical parameters of the diffusion pattern layer by varying the diffusion coefficient across different locations. The diffusion coefficient is adjusted to be higher at the center region and lower at the edge regions, which modifies the light distribution pattern to achieve uniformity and eliminate image imbalance.
3Manufacturing precision
If a diffusion pattern layer is applied to control image imbalance, then light distribution uniformity is improved, but device structure becomes more complex
Solution Approach 1:
The patent combines the diffusion pattern layer with the molding layer into a single integrated structure. The diffusion pattern is formed within the molding material itself, eliminating the need for a separate diffusion layer and reducing overall device complexity while still achieving the desired light distribution uniformity.
Solution Approach 2:
The patent uses composite materials by incorporating light diffusion particles or additives into the molding layer material. This creates a composite molding layer that inherently provides both structural support and light diffusion functions, simplifying the overall device structure while maintaining image uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module enhances manufacturing process efficiency and effectively controls image imbalance by reflecting and diffusing light, reducing light concentration at the center, thereby improving the uniformity of the entire light source.
Implementation Method 1
a reflective layer 30 including an opening 31 through which the semiconductor light emitting device 20 is exposed, and covering the circuit board 10
Implementation Method 2
a molding layer 40 covering the semiconductor light emitting device 20 and the reflective layer 30... efficiency of a manufacturing process can be improved, and a problem of image imbalance can be effectively controlled by applying the molding layer and the diffusion pattern layer
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~3c
AI summary
The present disclosure relates to a light emitting device module (100) including a circuit board (10), a semiconductor light emitting device (20) mounted on the circuit board (10), a reflective layer (30) including an opening (31) through which the semiconductor light emitting device (20) is exposed, and covering the circuit board (10), and a molding layer (40) covering the semiconductor light emitting device (20) and the reflective layer (30). A light emitting surface of the semiconductor light emitting device (20) is formed on an upper surface facing vertically upward.