Copper Oxide PCB Surface for Peel-Resistant High-Speed Wiring
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Solution Overview
Problem
Existing printed wiring boards face issues with peeling between conductor layers and resin insulating layers, especially under high stress or large dimensions, leading to potential transmission loss and noise during high-speed signal transmission.
Innovation Solution
The printed wiring board incorporates a copper oxide film on the conductor layer surface, enhanced with a nitrogen-based adhesive layer and a resin insulating layer, which strengthens adhesion through dipole interaction, reducing peeling and maintaining low transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional conductor layer and resin insulating layer structure is used, then the manufacturing process is simple, but peeling occurs between layers under stress or large dimensions
Solution Approach 1:
The invention changes the chemical composition parameter of the conductor layer surface by forming a copper oxide film (CuO or Cu2O) instead of using pure copper surface. This parameter change enables strong chemical bonding with the resin insulating layer through dipole interactions, preventing peeling while maintaining manufacturing feasibility through simple oxidation processes.
Solution Approach 2:
The invention creates a composite structure where a copper oxide film layer is formed on the copper conductor layer surface. This composite material approach combines the high conductivity of copper with the adhesive properties of copper oxide, achieving both electrical performance and strong bonding to the resin insulating layer.
2Reliability
If the conductor layer surface is left as pure copper, then the electrical conductivity is high, but adhesion to resin insulating layer is poor causing peeling
Solution Approach 1:
The invention carefully controls the oxidation parameters to form a thin copper oxide film that maintains good electrical conductivity while providing sufficient adhesion. By controlling film thickness and oxidation degree, the balance between conductivity and adhesion is optimized, preventing both peeling and excessive transmission loss.
Solution Approach 2:
The copper oxide film is formed specifically on the surface portion of the copper conductor layer that contacts the resin insulating layer, while the bulk copper layer maintains its high conductivity. This local quality change ensures adhesion at the interface without significantly degrading the overall electrical performance.
3Adaptability or versatility
If multiple conductor layers are stacked to increase functionality, then the device capability is enhanced, but peeling risk increases due to cumulative stress
Solution Approach 1:
By changing the surface parameter of each copper conductor layer to copper oxide, the invention ensures consistent strong adhesion across all layer interfaces. This allows multiple conductor layers to be stacked with reliable bonding at each interface, enabling enhanced functionality without proportional increase in peeling risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances adhesion between conductor and resin layers, preventing peeling even with multiple layers or large dimensions, ensuring low transmission loss and noise during high-speed signal transmission.
Implementation Method 1
The conductor layer includes a main component including copper such that the conductor layer includes a copper oxide film forming a surface thereof. An adhesive layer is formed on the conductor layer... strengthens adhesion through dipole interaction
Data Source
AI summary
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer. The conductor layer includes a main component including copper such that the conductor layer includes a copper oxide film forming a surface thereof.