Ceramic Anti-Warpage Carrier Structure for Large Package Flatness
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Solution Overview
Problem
The challenge in advanced semiconductor chip packaging lies in the warpage issues caused by the mismatch in thermal expansion coefficients between glass substrates and resin materials, leading to poor yield rates and stability during large-area splicing processes.
Innovation Solution
The use of ceramic plates with metal pillars and resin layers to form an anti-warpage carrier, enhancing thermal stability and mechanical strength, and employing ceramic engaging members and adhesive layers for improved flatness and assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If glass substrate is used as the core plate to achieve large dimension, then the carrier size can be increased, but thermal expansion coefficient mismatch with resin material causes warpage and poor yield rate
Solution Approach 1:
The patent changes the material parameter (thermal expansion coefficient) by replacing glass substrate with ceramic plates. The ceramic material has a thermal expansion coefficient that better matches the resin material, reducing thermal stress and warpage during temperature changes, thereby improving yield rate while maintaining large carrier dimensions.
Solution Approach 2:
The patent uses composite material structure by combining ceramic plates with metal pillars and resin materials. This composite approach leverages the low thermal expansion coefficient of ceramic to counteract the thermal expansion mismatch, resolving the warpage issue while achieving large carrier size with improved reliability.
2Stability of the object's composition
If glass fiber core plate is used to improve assembly process and coplanarity, then manufacturing stability is improved, but thermal expansion coefficient difference causes warpage during thermal process
Solution Approach 1:
The patent changes the material composition from glass fiber to ceramic plates, fundamentally altering the thermal expansion parameter. This enables the carrier to maintain coplanarity and flatness during thermal processes while preserving assembly stability, as the ceramic material's thermal properties better match the resin material.
3Reliability
If ceramic plate is used to reduce thermal expansion coefficient and warpage, then thermal stability is improved, but large dimension ceramic plates have poor uniformness and flatness
Solution Approach 1:
The patent segments the large-dimension ceramic plate into multiple smaller ceramic plates that are spliced together. This segmentation allows each individual ceramic plate to be manufactured with high precision and uniformness, while the spliced assembly achieves the required large dimension, thereby resolving the conflict between thermal stability and manufacturing precision.
Solution Approach 2:
The patent employs a splicing structure where multiple smaller ceramic plates are assembled to form a larger ceramic plate assembly. This nested approach enables the use of precisely manufactured small plates to create a large-dimension structure, maintaining both thermal stability and flatness uniformness that cannot be achieved with a single large plate.
4Manufacturing precision
If multiple small ceramic plates are spliced to form large dimension, then manufacturing precision is improved, but assembly complexity increases
Solution Approach 1:
The patent segments the large ceramic structure into multiple smaller, standardized plates with consistent dimensions and features. This standardization reduces the complexity of assembly by making each component identical or similar, allowing for modular assembly processes despite the multi-component nature of the structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic-based anti-warpage carrier reduces thermal expansion coefficient differences, addressing manufacturing challenges and enabling large-dimension advanced packaging applications with improved yield and stability.
Implementation Method 1
since the thermal expansion coefficient of the glass is greatly differed from the thermal expansion coefficient of the resin material used in the core substrate known to the inventor, after the thermal process of the lamination and building-up processes are performed, the carrier may have warpage issue
Implementation Method 2
The metal pillars are respectively in the second through holes
Implementation Method 3
The resin layer is on the upper surface of the substrate and the ceramic plate assembly. The resin layer covers the ceramic plates and the upper surface of the substrate
Implementation Method 4
The use of ceramic plates with metal pillars and resin layers to form an anti-warpage carrier, enhancing thermal stability and mechanical strength
Data Source
AI summary
An anti-warpage carrier includes a substrate, ceramic plates, metal pillars, a resin layer, and first and second circuit boards. The substrate has first through holes penetrating through an upper surface and a lower surface of the substrate. The ceramic plates are disposed on the upper surface and engaged with each other to form a ceramic plate assembly. The ceramic plate has second through holes penetrating through a first surface and a second surface of the ceramic plate. The metal pillars are respectively in the second through holes. The resin layer covers the ceramic plate assembly and the upper surface and has openings. The first circuit layer is on a portion of a surface of the resin layer, in the openings, and connected to the metal pillars. The second circuit layer is on a portion of the lower surface, in the first through holes, and connected to the metal pillars.