PCB Surface Current Bridge Layout for High-Current Power Modules
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Solution Overview
Problem
Existing PCB designs face challenges in efficiently supplying high currents due to increased thickness and DC resistance when multiple layers are added to enhance current flow capacity, affecting power supply efficiency and heat dissipation.
Innovation Solution
A printed circuit board design featuring a surface power layer with a first current flow bridge that covers and extends beyond the power region, and inner signal layers with second current flow bridges, increasing current flow area without adding layers, thereby reducing plane resistance and voltage drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of PCB layers is increased to improve current flow capacity, then the current carrying capability is improved, but the overall thickness of the PCB increases and power supply efficiency deteriorates
Solution Approach 1:
The patent transitions from a traditional multi-layer PCB approach (adding layers in the vertical dimension) to a surface-mounted current flow bridge approach (utilizing the surface plane dimension). The current flow bridge is disposed on the surface power layer and extends in the horizontal plane, allowing increased current capacity without increasing PCB thickness. This dimensional shift resolves the contradiction by achieving higher current carrying capability while maintaining compact thickness.
Solution Approach 2:
The current flow bridge is divided into multiple segments including a first current flow bridge portion, a second current flow bridge portion, and optional third and fourth portions. These segmented structures are distributed across the surface power layer, allowing the current path to be extended and optimized without requiring additional layers. The segmentation enables flexible routing and connection to multiple power regions while maintaining a single-layer surface configuration.
2Quantity of substance
If the number of PCB layers is increased to improve current flow capacity, then the current carrying capability is improved, but power supply efficiency decreases due to increased DC resistance
Solution Approach 1:
By moving the current flow enhancement from the vertical layer dimension to the horizontal surface dimension, the patent creates shorter current paths with fewer interfaces between layers. The current flow bridge on the surface power layer provides a direct, low-resistance path for high current, eliminating the cumulative DC resistance that would result from traversing multiple internal layers through vias and interconnections.
Solution Approach 2:
The current flow bridge merges multiple functional elements into a single integrated surface structure. It combines power distribution, current carrying, and thermal management functions in one component that sits on the surface power layer. This consolidation reduces the number of electrical interfaces and material transitions, thereby minimizing DC resistance and improving overall power supply efficiency.
3Quantity of substance
If the number of PCB layers is increased to improve current flow capacity, then the current carrying capability is improved, but the structural complexity increases
Solution Approach 1:
The patent resolves structural complexity by relocating the current flow enhancement feature from the internal multi-layer structure to the surface dimension. The current flow bridge is disposed on the surface power layer and can be fabricated using standard surface mounting techniques, avoiding the need for complex multi-layer routing, via drilling, and inter-layer alignment that would be required to achieve similar current capacity through additional internal layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances current flow capacity, reduces plane resistance, and improves power supply efficiency by effectively utilizing existing space, meeting high-current transmission requirements without increasing thickness or layer count.
Implementation Method 1
the first current flow bridge is provided at the surface power layer and electrically connected to the first power region, and the first current flow bridge covers the first power region and extends to outside of the first power region
Data Source
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AI summary
The present application discloses a printed circuit board, a power module and an electronic device. The printed circuit board includes: a surface power layer having a first power region for soldering a pin of the chip; and a first current flow bridge provided at the surface power layer and electrically connected to the first power region. The first current flow bridge covers the first power region and extends to outside of the first power region. The present application provides a printed circuit board, a power module and an electronic device.