Optical Module PCB Thermal Path for DSP Heat Dissipation
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Solution Overview
Problem
Optical modules generate significant heat during operation, particularly from digital signal processors, leading to performance degradation in high-temperature environments due to inefficient heat dissipation.
Innovation Solution
The optical module design includes a thermally conductive layer on the circuit board, thermally conductive via holes, and connecting blocks to transfer heat from the digital signal processor to the lower shell part, enhancing heat dissipation efficiency through multiple channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optoelectronic devices operate in high-temperature environment, then device functionality is maintained, but performance is compromised due to heat accumulation
Solution Approach 1:
The heat dissipation path is segmented into multiple channels: thermally conductive via holes for vertical heat transfer, thermally conductive plates for lateral heat distribution, and the lower shell part as the heat sink. This segmentation allows heat to be efficiently conducted away from the digital signal processor through multiple pathways, preventing heat accumulation while maintaining device performance.
Solution Approach 2:
Thermally conductive materials serve as intermediaries between the digital signal processor and the heat dissipation structure. The thermally conductive via holes and plates act as mediators to transfer heat from the processor to the lower shell part, enabling effective heat dissipation without direct thermal contact between the processor and the housing.
2Loss of energy
If thermally conductive structures are added to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The thermal management features are merged with the existing circuit board structure. The thermally conductive via holes are integrated into the circuit board layers, and the thermally conductive plates are positioned within the existing housing structure. This merging approach improves heat dissipation efficiency while minimizing the increase in device complexity by utilizing existing structural elements.
Solution Approach 2:
The lower shell part serves multiple functions: it provides structural support for the optical module and simultaneously acts as a heat sink for the digital signal processor. The thermally conductive plates also serve both as structural reinforcement elements and as heat distribution pathways. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency by effectively transferring heat from the digital signal processor to the lower shell part, maintaining optimal performance in high-temperature conditions.
Implementation Method 1
a thermally conductive via hole being provided between the upper layer board and the at least one thermally conductive plate, two ends of the thermally conductive via hole being respectively connected to the ground solder balls and the at least one thermally conductive plate, such that heat from the digital signal processor is conducted to the at least one thermally conductive plate through the thermally conductive via hole
Implementation Method 2
a thermally conductive layer being plated on the upper layer board, the thermally conductive layer contacting the lower side plates, and ground solder balls located at an edge of the digital signal processor being connected to the thermally conductive layer
Implementation Method 3
ground solder balls located at an inner side of the digital signal processor being electrically connected to the ground solder balls located at the edge of the digital signal processor through the thermally conductive connecting block
Data Source
AI summary
An optical module, wherein a digital signal processor is connected to a circuit board via solder balls. The circuit board includes an upper layer board, at least one thermally conductive plate and a lower layer board. A thermally conductive layer is plated on the upper layer board and contacts lower side plates of a lower shell part of the optical module. Ground solder balls at an edge of the digital signal processor are connected to the thermally conductive layer. A thermally conductive connecting block is disposed in the upper layer board. Ground solder balls at an inner side of the digital signal processor are connected to the ground solder balls through the thermally conductive connecting block. A thermally conductive via hole is provided between the upper layer board and the thermally conductive plate to transfer heat from the digital signal processor to the thermally conductive plate.