Cavity PCB Heat Dissipation Structure to Minimize Warpage
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Solution Overview
Problem
As circuit boards with deep cavities for mounting electronic components risk warpage due to asymmetric structures, there is a need for a heat dissipation structure with high thermal conductivity to manage heat generation while maintaining component mounting space.
Innovation Solution
A circuit board design featuring a heat dissipating portion within the cavity, extending from the upper surface to the side surface and beyond, with multiple heat dissipation patterns and via electrodes to efficiently disperse heat and secure mounting space for components of varying thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the depth of the circuit board cavity increases to mount more electronic components and reduce overall thickness, then the mounting space and thermal characteristics improve, but warpage risk increases due to asymmetric structure
Solution Approach 1:
The patent applies asymmetry principle by intentionally designing an asymmetric heat dissipation structure within the cavity. The heat dissipation portion is positioned to cover the side surface portion of the insulating layer, creating an asymmetric thermal conduction path that compensates for the asymmetric structural stress caused by deep cavity formation, thereby reducing warpage while maintaining mounting capacity
Solution Approach 2:
The patent changes the thermal conductivity parameter by introducing a heat dissipation portion with high thermal conductivity material. This heat dissipation structure extends from the upper surface portion to cover the side surface portion, creating efficient thermal conduction paths that manage heat generation from electronic components mounted in the deep cavity, preventing thermal warpage
2Length of stationary object
If the depth of the circuit board cavity increases to reduce overall product thickness, then the product thickness decreases, but heat dissipation difficulty increases
Solution Approach 1:
The patent transitions from two-dimensional heat dissipation (surface-level) to three-dimensional heat dissipation by extending the heat dissipation portion vertically to cover the side surface portion within the cavity. This multi-dimensional thermal conduction structure enables efficient heat transfer from electronic components deep within the cavity to the circuit board's external surfaces, maintaining effective heat dissipation while reducing overall product thickness
3Temperature
If a heat dissipation structure is added to manage thermal conductivity, then thermal characteristics improve, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing cavity structure. The heat dissipation portion is integrated within the cavity space, covering the side surface portion of the insulating layer, rather than adding separate external heat dissipation components. This integration approach improves thermal conductivity while minimizing additional structural complexity
Solution Approach 2:
The heat dissipation portion serves multiple functions simultaneously: it provides thermal conduction paths for heat dissipation, acts as a structural element within the cavity, and can serve as a mounting surface for electronic components. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively absorbs and disperses heat from electronic components, improving thermal characteristics and securing mounting space, while minimizing warpage risks.
Implementation Method 1
there is a risk that warpage may occur in the circuit board due to the asymmetric structure. Accordingly, it is necessary to provide a heat dissipation structure with high thermal conductivity inside the cavity
Data Source
AI summary
A disclosed circuit board may include an insulating layer including first and second surfaces opposing each other and having a cavity recessed from the first surface, and a heat dissipating portion partially positioned in the cavity. The insulating layer includes an upper surface portion configured to constitute the cavity and facing the second surface, and a side surface portion configured to surround the upper surface portion and to constitute the cavity. The heat dissipating portion is positioned to cover the side surface portion, and extends from the upper surface portion to the second surface through the insulating layer.