Embedded Component Carrier With Galvanic Stack Heat Paths
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Solution Overview
Problem
Existing component carriers face challenges in efficiently and reliably electrically connecting embedded components while managing heat dissipation and maintaining mechanical robustness, especially under harsh conditions.
Innovation Solution
A component carrier with a galvanic connection stack is used to electrically connect embedded components, formed by galvanic deposition on both main surfaces of a layer body, allowing precise and efficient electrical and thermal conductivity, potentially eliminating the need for additional processes like laser via formation and copper foil lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional embedding methods (through holes, temporary carriers, laser vias, copper foil lamination) are used to electrically connect embedded components, then electrical connectivity can be achieved, but the manufacturing process becomes complex and reliability is compromised
Solution Approach 1:
The patent removes the temporary carrier from the final product structure, using it only during the embedding process. This extraction eliminates the need for complex release mechanisms and subsequent repair processes, simplifying the overall manufacturing while maintaining high reliability of electrical connections.
Solution Approach 2:
The patent combines multiple functions into the component carrier structure itself: the carrier provides both mechanical support and electrical connectivity through integrated conductive paths. This merging eliminates the need for separate connection processes like laser via formation and copper foil lamination, reducing manufacturing complexity while improving reliability.
2Productivity
If component density and functionality are increased with smaller spacing between contacts, then product functionality and integration are improved, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The patent applies different material properties to different regions of the component carrier. The carrier structure incorporates materials with high thermal conductivity in specific areas to enhance heat dissipation from high-density component regions, while maintaining electrical conductivity where needed. This localized optimization allows high component density without compromising thermal management.
3Strength
If component carriers are designed for harsh conditions with enhanced robustness, then mechanical strength and environmental resistance are improved, but manufacturing precision and assembly ease may be compromised
Solution Approach 1:
The patent divides the component carrier into functional segments: a robust structural base for mechanical strength and environmental resistance, and integrated conductive paths for electrical connectivity. This segmentation allows the structural portion to be optimized for harsh conditions while the conductive portions are designed for ease of manufacturing through standard embedding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a component carrier with excellent electrical, mechanical, and thermal reliability, enabling precise manufacturing and effective heat removal, while maintaining robustness and reliability under harsh conditions.
Implementation Method 1
at least one galvanic connection stack at least partially on at least part of at least one main surface of the layer body, wherein at least one of a bottom main surface and a top main surface of the embedded component is electrically connected to the at least one galvanic connection stack
Data Source
AI summary
A component carrier includes a layer body with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component embedded in the layer body, and at least one galvanic connection stack at least partially on at least part of at least one main surface of the layer body. At least one of a bottom main surface and a top main surface of the embedded component is electrically connected to the at least one galvanic connection stack.