Networked Connection Wiring Layout for Peel-Resistant Substrates
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Solution Overview
Problem
Existing wiring substrates face issues with peeling-off of insulating and wiring layers due to thermal expansion mismatch and chemical solution penetration during protective plating treatment, leading to copper wiring corrosion and contamination.
Innovation Solution
A wiring substrate design with a connection wiring area between main wiring and electrical contact, featuring a network structure of conductive and non-conductive areas, which includes a plurality of connection wiring sections separated by holes, to reduce stress concentration and prevent layer peeling and chemical solution penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective plating treatment is performed on the land, then corrosion resistance is improved, but peeling-off of insulating layer and wiring layer occurs due to stress and chemical solution penetration
Solution Approach 1:
The connection area is divided into multiple connection sections (first connection section, second connection section, etc.) that are separated by non-conductive areas. This segmentation distributes the stress from protective plating treatment across multiple smaller sections rather than concentrating it in one large area, preventing peeling-off of the insulating and wiring layers while maintaining corrosion resistance through the distributed conductive paths.
2Stability of the object's composition
If the wiring layer is made wider to reduce stress concentration, then layer adhesion is improved, but the area occupied by wiring increases
Solution Approach 1:
Instead of widening the entire wiring layer, the invention segments the connection area into multiple connection sections separated by non-conductive areas. This approach maintains adequate wiring width in each section for stress distribution while the overall wiring footprint is optimized by the compact arrangement of segmented sections, preventing both peeling-off and excessive area occupation.
Solution Approach 2:
The wiring layer is designed with different properties in different regions: the connection areas provide conductive paths with sufficient width for mechanical strength, while the non-conductive areas between them provide stress relief and chemical barrier functions. This local differentiation allows the wiring to achieve both adhesion stability and area efficiency.
3Stability of the object's composition
If chemical solution penetration is prevented by sealing the joint, then layer adhesion is improved, but manufacturing complexity increases
Solution Approach 1:
The connection area is segmented into multiple sections separated by non-conductive areas, which naturally act as barriers to chemical solution penetration. This segmentation prevents chemical solutions from reaching deep into the joint region without requiring additional sealing structures, thereby maintaining layer adhesion while avoiding increased manufacturing complexity.
Solution Approach 2:
The non-conductive areas serve as intermediary regions between the conductive connection sections. These non-conductive areas act as barriers that prevent chemical solution penetration into the joint while maintaining the structural integrity and electrical connectivity of the wiring, without introducing complex sealing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the resistance to thermal stress and chemical penetration, preventing peeling-off and corrosion, allowing for high-density integration and improved reliability of the wiring substrate.
Implementation Method 1
an insulating layer 103 having an opening 103A corresponding to at least a part of the pad 112, the insulating layer 103 covering the wiring layer 102
Implementation Method 2
a protective plating layer 104 formed on a surface of the pad 112 at the opening 103A
Implementation Method 3
peeling-off of an insulating layer and a wiring layer caused by aging degradation
Data Source
AI summary
A wiring layer includes a connection wiring area between a wiring area and a pad. The connection wiring area includes a plurality of connection wiring sections. The plurality of connection wiring sections are individually separated by a plurality of holes. The wiring area includes the plurality of holes that are formed such that a conductive area including the plurality of connection wiring sections has a network structure in the connection wiring area. At least one connection wiring section and at least one hole are allowed to be located in a linear band connecting a connection area located on the wiring area side and a connection area located on the pad side.