Computing Card PCB Layout for CAMM Memory and Heat Sink Space
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Solution Overview
Problem
Conventional computing device cards face issues with limited memory capacity, reduced processing system size, and thermal management due to the positioning of DIMM and CAMM subsystems, which restrict access and increase costs.
Innovation Solution
A computing device card system with a secondary circuit board connected to the primary circuit board bottom surface, allowing CAMM devices to be positioned on the bottom surface, thereby increasing the volume below the primary circuit board and maintaining access to memory subsystems without limiting the processing system size or heat sink width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If DIMM subsystems are mounted on the PMM card to provide memory capacity, then memory capacity is improved, but the card component envelope volume is reduced and access is limited
Solution Approach 1:
The patent transitions from mounting memory subsystems on the top surface of the PMM card to mounting them on the bottom surface. This dimensional change allows the memory subsystems to be positioned in the previously underutilized bottom volume, increasing the available card component envelope volume for other components while maintaining memory capacity.
2Quantity of substance
If DIMM subsystems are positioned on the PMM card to provide memory capacity, then memory capacity is improved, but processing system size is reduced
Solution Approach 1:
By relocating memory subsystems to the bottom surface of the PMM card, the processing system can be positioned centrally on the top surface without spatial constraints from memory subsystems. This allows the processing system to achieve its full required size without being limited by the card component envelope volume.
3Quantity of substance
If DIMM subsystems are positioned on the PMM card to provide memory capacity, then memory capacity is improved, but thermal management is worsened
Solution Approach 1:
Positioning memory subsystems on the bottom surface of the PMM card allows heat sinks to be mounted on the top surface, creating effective thermal separation. The heat sinks can extend across the width of the PMM card without interfering with memory subsystems, improving thermal management while maintaining memory capacity.
4Temperature
If CAMM subsystems are used to reduce memory subsystem height, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent divides the card into two distinct surfaces: the top surface for the processing system and the bottom surface for memory subsystems. This segmentation allows independent optimization of each area, with the processing system accessing memory through the bottom surface connection interface, reducing the need for complex integrated designs.
Data Source
AI summary
A computing device card system includes a primary circuit board having an opposing primary circuit board top surface and bottom surface with an edge between them. A secondary circuit board includes an opposing secondary circuit board top surface and bottom surface with an edge between them. The secondary circuit board is connected to the primary circuit board bottom surface, and the secondary circuit board edge includes computing device connectors. The secondary circuit board extends from the primary circuit board edge such that the secondary circuit board edge is spaced apart from the primary circuit board edge. A bottom surface component envelope is defined adjacent the primary circuit board bottom surface and is based on the computing device connectors. Bottom surface component(s) extends from the primary circuit board bottom surface and are located within the bottom surface component envelope.