Curved Display PCB Layout for Chip-on-Film Stress Relief

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Solution Overview

Problem

Curved display apparatuses apply concentrated stress on chip-on-films and printed circuit boards due to curvature, leading to potential damage.

Innovation Solution

The display apparatus is designed with a specific arrangement of chip-on-films and printed circuit boards, where the number of chip-on-films connected to different PCBs varies, and the PCBs are separated at points of high curvature deformation to distribute stress evenly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If the display apparatus is designed with curvature, then the display module achieves a curved shape for aesthetic and functional purposes, but concentrated stress is applied on the chip-on-films and connected PCBs

Engineering Contradiction:
Improvecurved shape of display moduleVSAvoidconcentrated stress on chip-on-films and PCBs
Core Design Contradiction:
ShapeVSStress or pressure

Solution Approach 1:

The patent divides the previously single PCB into multiple separate PCBs (first PCB, second PCB, third PCB) positioned at different locations. This segmentation allows each PCB to independently support specific chip-on-films, distributing the stress caused by curvature across multiple components rather than concentrating it on a single PCB, thereby resolving the contradiction between achieving curved shape and reducing stress concentration.

Inventive Principle:
Principle #1Segmentation

2Stress or pressure

If multiple PCBs are used to distribute stress, then stress concentration is reduced, but the device complexity increases

Engineering Contradiction:
Improvestress distribution on PCBsVSAvoidnumber of PCBs and their arrangement
Core Design Contradiction:
Stress or pressureVSDevice complexity

Solution Approach 1:

The patent applies local quality by positioning each PCB at specific locations where chip-on-films are connected to the display panel. The first PCB supports chip-on-films at a first location, the second PCB supports chip-on-films at a second location, and the third PCB supports chip-on-films at a third location. This localized arrangement ensures that each PCB handles stress only in its specific region, achieving effective stress distribution while maintaining a relatively simple and organized device structure.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12517401B2Display apparatus
Publication Date: 2026.01.06 SAMSUNG ELECTRONICS CO LTD
  • US12517401B2 patent drawing
  • US12517401B2 patent drawing
  • US12517401B2 patent drawing

AI summary

A display apparatus includes a display panel having a curvature, a plurality of chip-on-films connected to a side of the display panel, a first printed circuit board (PCB) connected to a first part of the plurality of chip-on-films, and a second PCB provided farther outside of the display panel than the first PCB from a center of the display panel, the second PCB being connected to a second part of the plurality of chip-on-films, and a number of chip-on-films of the second part of the plurality of chip-on-films is different than a number of chip-on-films of the first part of the plurality of chip-on-films.