Layered Carrier Structure for Contactless Conductor Coupling
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Solution Overview
Problem
Conventional methods for manufacturing objects with electronic units on flexible substrates are inefficient and costly due to the need for soldering or conductive adhesives, which slow down the manufacturing process and increase material costs, especially when only a few connections are required on large-area films.
Innovation Solution
The support structure is designed as a stack of layers, with electronic units on one layer and conductor structures on another, allowing for galvanic isolation and capacitive or inductive coupling without soldering or conductive adhesives, enabling higher throughput and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or conductive adhesives are used to connect electronic units to flexible substrates, then reliable electrical connections are achieved, but manufacturing process time increases and material costs increase
Solution Approach 1:
The patent extracts the connection function from the electronic unit itself and relocates it to the flexible substrate. By integrating conductor structures directly into the substrate layers, the need for separate soldering or adhesive application processes is eliminated, thereby improving throughput while maintaining connection reliability
Solution Approach 2:
The conductor structures are pre-integrated into the flexible substrate during substrate manufacturing, before the electronic units are assembled. This preliminary integration of conductive pathways eliminates the need for post-assembly connection processes, thereby increasing manufacturing productivity without compromising connection reliability
2Reliability
If soldering or conductive adhesives are used to connect electronic units to flexible substrates, then reliable electrical connections are achieved, but material costs increase
Solution Approach 1:
The patent removes the need for separate solder or conductive adhesive materials by integrating conductor structures directly into the flexible substrate layers. This eliminates additional material costs while maintaining reliable electrical connections through the embedded conductive pathways
Solution Approach 2:
The flexible substrate serves multiple functions: it provides mechanical support, contains integrated conductor structures for electrical connections, and enables flexibility. This multi-functionality eliminates the need for separate connection materials, reducing material costs while maintaining connection reliability
3Area of stationary object
If large-area films are used with few connections, then flexibility and coverage are improved, but manufacturing efficiency decreases due to slower connection processes
Solution Approach 1:
The patent divides the flexible substrate into multiple layers, with conductor structures integrated into different layers. This segmentation allows parallel processing of multiple connection points across different layers, thereby improving manufacturing throughput while maintaining large substrate area and flexibility
Solution Approach 2:
The patent transitions from planar connections on a single layer to three-dimensional multi-layer connections. By stacking conductor structures across multiple layers, the system achieves high-density interconnections on large-area flexible substrates without increasing process time, thereby improving manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and effort by allowing simultaneous production of multiple units on smaller layers, while maintaining electrical functionality through capacitive or inductive coupling, thus enhancing efficiency and cost-effectiveness.
Implementation Method 1
the first conductor structure and the second conductor structure are capacitively or inductively coupled to one another
Implementation Method 2
the first conductor structure and the second conductor structure are capacitively or inductively coupled to one another
Data Source
Figure 1~2
Figure 3~5
Figure 6~10
AI summary
The invention relates to an object (100) which comprises at least a first conductor structure (1), at least one electronic unit (5), at least a second conductor structure (2), which is galvanically isolated from the first conductor structure (1) and/or from the electronic unit (5), but can be electrically coupled thereto, and a carrier structure (15) having at least a first carrier layer (10), a first carrier layer region (11) of the first carrier layer (10) and a second carrier layer region (21). The carrier structure (15) is designed as a layer stack (16) in a base surface region (G) which comprises at least a part of the base surface of the carrier structure (15). The layer stack (16) comprises at least the first carrier layer region (11) of the first carrier layer (10) and the second carrier layer region (21). Furthermore, at least a part of the first (1) and the second conductor structure (2) is arranged in the base surface region (G). The first conductor structure (1) and/or the electronic unit (5) is soldered or bonded to the first carrier layer region (11) or is otherwise connected to the first carrier layer region (11), whereas the second conductor structure (2) is soldered or bonded to the second carrier layer region (12; 21) or otherwise connected to the second carrier layer region (21).