Sealed Camera Assembly With Heat Sink and Vent Cooling
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Solution Overview
Problem
Embedded systems in camera assemblies are vulnerable to external impacts, moisture, and foreign substances, and require effective heat dissipation.
Innovation Solution
A camera assembly design featuring a base with a recessed portion housing a circuit board, sealed by a heat sink and rubber pad, with thermal pads for heat conduction, and vents for airflow to dissipate heat, while protecting the circuit board from external damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is disposed inside the camera assembly, then the embedded system can control the camera, but the circuit board is easily damaged by external impact, moisture, and foreign substances
Solution Approach 1:
The circuit board is nested within a recessed cavity formed in the base structure. This cavity provides physical protection by enclosing the circuit board, shielding it from external impacts, moisture, and foreign substances while maintaining its functional integration within the camera assembly.
Solution Approach 2:
A seal member is introduced as an intermediary element between the circuit board and the external environment. This seal member fills the opening of the recessed cavity, creating a barrier that prevents moisture and foreign substances from reaching the circuit board while allowing the embedded system to function.
2Reliability
If the circuit board is disposed inside the camera assembly, then the embedded system can control the camera, but heat generated from the circuit board needs to be dissipated
Solution Approach 1:
The heat dissipation function is extracted from the base structure itself and implemented as a separate heat sink component. This heat sink is specifically designed to contact the circuit board and extract heat, allowing the base to focus on providing structural support and protection while the heat sink handles thermal management.
Solution Approach 2:
The heat sink serves multiple functions: it acts as a thermal management component to dissipate heat from the circuit board, and simultaneously functions as part of the sealing structure to protect the circuit board from external environmental factors, combining protection and heat dissipation in a single component.
3Temperature
If a heat sink is added to dissipate heat, then heat can be dissipated from the circuit board, but the structure becomes more complex
Solution Approach 1:
The heat sink is merged with the sealing structure, combining two previously separate functions (heat dissipation and environmental protection) into a single integrated component. This reduces the number of separate parts needed and simplifies the overall assembly process while maintaining both heat dissipation and protection capabilities.
Solution Approach 2:
The heat sink is designed to perform multiple functions simultaneously: it dissipates heat through its thermal conduction properties, and at the same time serves as part of the sealing mechanism that protects the circuit board from moisture and foreign substances, reducing the need for additional separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides robust protection against external impacts and moisture, while effectively dissipating heat through conduction and airflow, ensuring reliable operation of the embedded system.
Implementation Method 1
a first thermal pad between and in contact with the circuit board and the heat sink
Implementation Method 2
a blower on one side of the heat sink... the first vent is configured to discharge air, blown from the blower, in the blowing direction to an outside of camera assembly
Implementation Method 3
a rubber pad between the base and the heat sink... the circuit board is sealed from an outside of the camera assembly by the heat sink and the rubber pad
Data Source
AI summary
A camera assembly may include: a camera; a base connected to the camera; a circuit board accommodated by the base; a heat sink on the circuit board; a rubber pad between the base and the heat sink; and a first thermal pad between and in contact with the circuit board and the heat sink, wherein the circuit board is sealed from an outside of the camera assembly by the heat sink and the rubber pad.