Inertial Sensor Assembly Layout for Thermal and Vibration Isolation
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Solution Overview
Problem
Industrial-grade inertial sensors face challenges in limited spaces due to thermal expansion, mechanical vibrations, and shocks, which affect performance and require improved assembly methods.
Innovation Solution
A sensor assembly design using separate printed boards with thicker stencils and flexible structures, coupled with a press structure and FPC cable connections, isolates inertial sensors from mechanical impacts and thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the IMU volume is reduced to meet design requirements, then the device fits limited spaces, but thermal expansion from electronic components causes printed circuit board stress that negatively impacts sensor performance
Solution Approach 1:
The patent divides the IMU into distinct functional modules: a sensor module containing inertial sensors mounted on a first circuit board, and a separate processing module with electronic components mounted on a second circuit board. This segmentation isolates the sensors from thermal expansion effects generated by processing components, allowing the IMU to maintain compact volume while preserving sensor reliability through reduced thermal stress on the circuit board.
2Strength
If mechanical covers, connectors, screws, and circuit boards are used to assemble the IMU, then the device is structurally sound, but mechanical vibrations and shocks travel through these components and negatively impact the inertial sensors
Solution Approach 1:
The patent introduces vibration isolation elements as intermediary components between the sensor module and the housing/processing module. These elements (such as elastomeric mounts or damping materials) are positioned at critical transmission paths including connector interfaces and mounting points, serving as mediators that allow structural assembly while blocking the transmission of mechanical vibrations and shocks to the sensitive inertial sensors.
Solution Approach 2:
The patent modifies the mechanical properties of assembly components by selecting materials with specific damping characteristics and compliance levels for vibration isolation elements. By changing parameters such as material hardness, damping coefficient, and mounting stiffness, the system maintains structural integrity while reducing vibration transmission to the sensors through optimized mechanical parameter selection.
3Volume of moving object
If electronic components are densely packed to reduce size, then the IMU volume decreases, but thermal expansion causes increased stress on the printed circuit board and sensors
Solution Approach 1:
The patent segments the electronic components and sensors onto separate circuit boards mounted at different locations within the IMU housing. This spatial segmentation creates thermal zones where heat-generating components are isolated from temperature-sensitive sensors, reducing thermal expansion stress on shared circuit board structures while maintaining compact overall volume through efficient three-dimensional layout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances vibration and shock protection, maintains performance in limited spaces, and reduces thermal impact on inertial sensors.
Implementation Method 1
at least one vibration protection structure coupled between the sensor board and an inner surface of the lower housing portion
Implementation Method 2
a press structure positioned over the at least one vibration protection structure and separated from the sensor board
Data Source
AI summary
A sensor assembly comprises a lower housing portion; a sensor board positioned in the lower housing portion, with the sensor board having a bottom surface and a top surface; and one or more inertial sensors connected to the bottom surface of the sensor board. At least one vibration protection structure is coupled between the sensor board and an inner surface of the lower housing portion, and a press structure is positioned over the at least one vibration protection structure and separated from the sensor board. A mother board is positioned in the lower housing portion above and separated from the press structure and the sensor board, with the mother board having a bottom surface and a top surface.