Reinforced Carrier Structure for Impact-Resistant Chip Packaging
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Solution Overview
Problem
The challenge in advanced semiconductor chip packaging lies in achieving flatness and thermal stability of material substrates, particularly glass fiber core plates, which are prone to cracks and mechanical strength, due to external forces.
Innovation Solution
The solution involves a substrate with a rigid insulated carrier sheet, which includes a substrate, metal pillars, a resin layer, and a circuit layer, and a circuit layer, with a buffering layer covering the periphery and recesses to enhance impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the thickness of the core plate is increased to improve flatness and stability, then the coplanarity and stability of packaging planes are improved, but the thermal stability deteriorates due to glass fiber material limitations
Solution Approach 1:
The patent employs a composite structure combining glass fiber core plate with ceramic substrate. The glass fiber provides mechanical strength and flatness, while the ceramic substrate (such as alumina or silicon oxide) provides superior thermal stability. This composite approach allows the carrier to achieve both mechanical stability and thermal resistance, resolving the contradiction between flatness improvement and thermal stability deterioration.
2Strength
If glass fiber core plate is used to improve mechanical strength, then the carrier can withstand external forces, but cracks occur at the corners during delivery and testing
Solution Approach 1:
The patent uses a composite structure where the glass fiber core plate is combined with a ceramic substrate. The ceramic material provides exceptional crack resistance and toughness, complementing the mechanical strength of the glass fiber. This composite approach enables the carrier to withstand external forces during delivery and testing without developing cracks, particularly at vulnerable corner regions.
Solution Approach 2:
The patent applies different material properties to different regions of the carrier. The ceramic substrate is specifically positioned at the corners and edges where cracks most commonly occur, providing localized reinforcement and crack resistance. This local quality approach ensures that the most vulnerable areas receive the additional protection needed to prevent crack formation during handling and testing.
3Area of stationary object
If the carrier plate size is increased to meet large-area packaging requirements, then the coplanarity is improved, but the impact resistance deteriorates due to longer logistics time and external forces
Solution Approach 1:
The patent employs a composite structure combining glass fiber core plate with ceramic substrate. The ceramic material provides high impact resistance and toughness, enabling the large-area carrier plate to withstand external forces during logistics and handling. This composite approach allows the carrier to maintain both large size for coplanarity and sufficient impact resistance for safe delivery.
Data Source
AI summary
An impact-resistant reinforced carrier includes a substrate, a rigid insulated carrier sheet, metal pillars, a resin layer, and first and second circuit layers. The substrate has first through holes penetrating through upper and lower surfaces of the substrate. The rigid insulated carrier sheet has second through holes penetrating through first and second surfaces of the rigid insulated carrier sheet. The metal pillars are respectively in the second through holes. The resin layer covers the rigid insulated carrier sheet and the upper surface and has openings. The first circuit layer is on a portion of a surface of the resin layer, in the openings, and connected to the metal pillars. The second circuit layer is on a portion of the lower surface, in the first through holes, and connected to the metal pillars.