Modular Thermal Shock Units for Rapid Electronic Component Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thermal shock test chambers are large, cumbersome, expensive, and unreliable, with slow temperature transitions, making them inefficient for testing electronic components.
Innovation Solution
A thermal shock test system utilizing modular, portable thermal shock units with closed-loop fluid systems for rapid temperature transitions, minimizing moving parts and enabling efficient testing of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional thermal shock test chambers are used, then temperature transitions are performed using air as thermal medium, but the temperature transition speed is slow and the system is large and cumbersome
Solution Approach 1:
The patent replaces air-based thermal shock with liquid-based thermal shock systems. The liquid circulation system uses pumps and heat exchangers to rapidly transfer thermal energy to and from the test chamber, achieving much faster temperature transition speeds compared to conventional air-based systems while allowing for a more compact chamber design.
Solution Approach 2:
The patent changes the thermal medium from gas (air) to liquid, fundamentally altering the thermal transfer parameters. Liquid provides higher heat capacity and thermal conductivity, enabling rapid temperature transitions. The system also implements precise control of liquid flow rates and temperatures to optimize the thermal shock profile.
2Productivity
If conventional thermal shock test chambers are used, then the system is large and cumbersome, but the system complexity and cost increase
Solution Approach 1:
The patent divides the thermal shock system into modular components: a test chamber, a liquid circulation system with separate heating and cooling loops, heat exchangers, and control systems. This segmentation allows for easier manufacturing, assembly, maintenance, and scaling of the system while reducing overall complexity through standardized interfaces and independent subsystems.
3Speed
If conventional thermal shock test chambers are used, then the system is reliable for testing, but the temperature transition speed is slower than optimal
Solution Approach 1:
The patent implements comprehensive feedback control systems with temperature sensors positioned throughout the test chamber and liquid circulation loops. The control system continuously monitors temperature profiles and adjusts pump speeds, heat exchanger configurations, and liquid flow rates in real-time to maintain precise thermal shock profiles, ensuring both rapid transitions and test reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system facilitates faster temperature changes, reduces system size and cost, and enhances testing efficiency by allowing for extensible and portable thermal shock testing.
Implementation Method 1
the liquid may be in direct contact with the electronic component during the thermal shock test... The liquid... may facilitate a faster temperature change
Implementation Method 2
A thermal shock test system may include at least one thermal shock unit, a first temperature regulator configured to house and maintain a first fluid at a first temperature, a second temperature regulator configured to house and maintain a second fluid at a second temperature
Implementation Method 3
a first temperature regulator configured to house and maintain a first fluid at a first temperature, a second temperature regulator configured to house and maintain a second fluid at a second temperature
Implementation Method 4
a first temperature regulator configured to house and maintain a first fluid at a first temperature, a second temperature regulator configured to house and maintain a second fluid at a second temperature
Data Source
AI summary
Systems and techniques for performing a thermal shock test are discussed herein. The thermal shock test system includes a first thermal shock unit associated with a first electronic component, a second thermal shock unit associated with a second electronic component, a first temperature regulator that maintains a first fluid at a first temperature, and a second temperature regulator that maintains a second fluid at a second temperature. The thermal shock test system may be configurable between a first configuration and a second configuration. The first configuration includes the first thermal shock unit being associated with the first fluid and the second thermal shock unit being associated with the second fluid. The second configuration includes the second thermal shock unit being associated with the first fluid and the first thermal shock unit being associated with the second fluid. The thermal shock unit may transition between the first configuration and the second configuration within a time period that causes the first electronic component and the second electronic component to experience a thermal shock. The first electronic component and the second electronic component may be evaluated for failure after the thermal shock.