Framed Glass PCB Structure for Crack-Resistant Processing
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Solution Overview
Problem
Glass substrates used in electronic products are prone to fracturing during processing or transportation, leading to potential product defects due to cracks and the entry of glass particles.
Innovation Solution
A printed circuit board design incorporating a glass layer within a frame with a through-portion, filled by a first insulating material, and surrounded by second and third insulating materials of different compositions on upper and lower sides, which differ in thermal expansion coefficients to generate compressive stress and prevent cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If glass substrates are used in electronic products, then heat dissipation and warpage control are improved, but cracks and fractures occur during processing or transportation
Solution Approach 1:
The patent changes the physical state of the glass substrate by introducing compressive stress through thermal expansion coefficient mismatch. The insulating materials have higher thermal expansion coefficients than the glass layer, creating compressive stress that prevents crack propagation and improves reliability while maintaining heat dissipation properties.
Solution Approach 2:
The patent creates a composite structure consisting of the glass layer combined with insulating materials having different thermal expansion coefficients. This composite design allows the glass substrate to maintain its superior heat dissipation and warpage control while the surrounding insulating materials provide compressive stress to prevent fractures.
2Area of stationary object
If glass substrates are used, then large-area and microcircuit implementation are improved, but glass particles enter the product through processing equipment or chemicals
Solution Approach 1:
The insulating materials act as intermediary layers between the glass substrate and the processing environment. These materials protect the glass layer during processing and transportation, preventing glass particles from detaching and entering the product, while still allowing the glass substrate to provide large-area implementation capabilities.
3Reliability
If insulating materials with different thermal expansion coefficients are used to prevent cracks, then structural integrity is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by using insulating materials with specific thermal expansion properties only in regions where they are needed to provide compressive stress to the glass layer. The first insulating material is positioned between the glass layer and frame, while second and third insulating materials are positioned on opposite sides, creating localized stress fields that prevent cracks without requiring complex modifications throughout the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents cracks and fractures in the glass layer by generating compressive stress through the use of insulating materials with varying thermal expansion coefficients, enhancing structural integrity and reducing warpage.
Implementation Method 1
second and third insulating materials disposed on each of an upper side and a lower side of the frame and the glass layer are formed of different materials... insulating materials with varying thermal expansion coefficients to generate compressive stress
Data Source
AI summary
The present disclosure relates to a printed circuit board including: a frame having a through-portion; a glass layer at least partially disposed within the through-portion; a first insulating material filling at least a portion of a space between the frame and the glass layer; a second insulating material disposed on upper sides of the frame and the glass layer; and a third insulating material disposed on lower sides of the frame and the glass layer, and the first insulating material includes a material different from the second and third insulating materials.