Camera Module Assembly with Throughbore Solder Ball Alignment
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Solution Overview
Problem
Existing camera unit assembly methods face challenges in achieving robust and efficient alignment and soldering of lens holder and circuit board modules due to limited solder volume, restricted soldering energy, and operational space constraints.
Innovation Solution
Incorporating partially occluded throughbores in the lens holder module to accommodate solder balls, allowing them to melt and flow onto the circuit board pads, forming a secure solder joint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pins are used to attach the lens holder to the circuit board through apertures, then alignment between modules is achieved, but the aperture volume is limited and insufficient solder material is available to fill the gap
Solution Approach 1:
The throughbore is segmented into two distinct sections: an upper larger-diameter portion and a lower smaller-diameter portion. This segmentation allows the upper section to accommodate sufficient solder material volume while the lower section maintains alignment precision with the circuit board aperture, thereby resolving the contradiction between alignment precision and solder material volume.
Solution Approach 2:
Different sections of the throughbore have different local qualities - the upper section has a larger diameter to provide sufficient solder material volume, while the lower section has a smaller diameter to ensure precise alignment with the circuit board aperture. This local differentiation resolves the contradiction by optimizing each section for its specific function.
2Volume of moving object
If the gap between imager circuit board and lens holder is made very small to achieve compact assembly, then the camera unit size is reduced, but the soldering energy importing angle is limited
Solution Approach 1:
The throughbore extends in the vertical dimension through both modules, providing a three-dimensional pathway for solder material and energy. This vertical dimensionality allows soldering energy to be imported effectively even when the horizontal gap between modules is minimized, resolving the contradiction between compact volume and soldering energy efficiency.
3Measurement precision
If pins are precisely aligned with apertures before insertion to ensure proper positioning, then alignment accuracy is maintained, but operation space is limited
Solution Approach 1:
The throughbore is pre-formed with a larger upper diameter that facilitates easy insertion of the lens holder, followed by a smaller lower diameter that ensures precise alignment with the circuit board aperture. This preliminary design of the throughbore geometry eliminates the need for precise pre-alignment operations while maintaining final alignment accuracy, thereby resolving the contradiction between alignment accuracy and operation space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the mechanical strength and reliability of the camera unit assembly by ensuring proper alignment and secure soldering, while minimizing visual obstruction.
Implementation Method 1
soldering energy can be imparted through the throughbore to a solder ball, causing the solder ball to melt and at least partially flow from the bottom of the throughbore and onto a pad of the circuit board
Implementation Method 2
the soldering energy provided by laser
Data Source
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AI summary
A camera unit assembly which improves efficiency and quality of the soldering affixing lens holder and circuit board modules by providing partially occluded throughbores within a mounting part of the lens holder module, which can accommodate a solder ball, and into which soldering energy can be imparted allowing the solder ball to melt and at least partially flow from the bottom of the throughbore and onto a pad of the circuit board.