Capacitance Scanning of Conductive Patterns for Fast Defect Inspection
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Solution Overview
Problem
Existing manufacturing processes for semiconductor devices face challenges in efficiently identifying defects during the patterning process, particularly in conductive patterns, which can affect the operation of the finished product, with current inspection methods having long cycle times and limited throughput.
Innovation Solution
A device and method using sensor plates to generate an electric field with a conductive pattern on a substrate, measuring capacitance changes to identify defects by relative scanning, and utilizing a controller to detect regions with defects based on capacitance variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional inspection methods are used to identify defects in conductive patterns, then measurement precision can be maintained, but productivity is reduced due to long cycle times
Solution Approach 1:
The patent replaces traditional mechanical/optical inspection systems with an electrical field-based capacitance measurement system. Sensor plates generate electric fields that interact with conductive patterns on substrates, and capacitance changes are measured to detect defects. This substitution of mechanical/optical methods with electrical field methods enables faster measurement cycles while maintaining defect detection capability.
Solution Approach 2:
The patent changes the measurement parameter from optical properties to electrical capacitance. By measuring capacitance variations between sensor plates and conductive patterns at different frequencies, the system can rapidly identify defects in conductive patterns. This parameter change enables faster inspection cycles compared to traditional optical methods.
2Measurement precision
If comprehensive defect identification is performed across the entire substrate, then measurement precision is improved, but loss of time increases due to extended inspection duration
Solution Approach 1:
The patent implements continuous capacitance measurement as sensor plates are moved across the substrate. The electric field interaction and capacitance measurement occur continuously during the scanning process, eliminating the need for discrete measurement stops. This continuous measurement approach maintains comprehensive defect coverage while reducing total inspection time.
Solution Approach 2:
The patent performs preliminary capacitance measurements across the entire substrate using the electric field method before more detailed analysis is required. This preliminary scanning identifies potential defect regions quickly, allowing subsequent focused inspection only where needed, thereby reducing overall inspection time while maintaining detection accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and thorough defect identification in conductive patterns, reducing cycle times and improving throughput by providing early indicators of yield issues in semiconductor manufacturing.
Implementation Method 1
a voltage source, configured to generate an electric field between the sensor plates and the conductive pattern on the substrate
Implementation Method 2
measuring changes in capacitance between the sensor plates and the substrate
Data Source
AI summary
A device for inspecting a conductive pattern on a substrate includes a plurality of sensor plates, a table configured and arranged to support the substrate, a voltage source configured to generate an electric field between the sensor plates and the conductive pattern on the substrate, an actuator configured to move the sensor plates relative to the substrate, and a controller configured and arranged to identify regions having defect on the basis of changes in capacitance between the sensor plates and the substrate as the sensor plates are moved relative to the substrate.