Contactless Circuit Testing TRIZ Cases
- RF Measurement Setup for Selective ADC Overload Protection
Selective attenuation protects ADCs from RF power spikes while preserving critical signal portions for accurate measurement.
- Pulse Electron Microscopy for Partial Disconnection Detection
Timed dual laser pulses generate sequential electron pulses to reveal partial disconnections without slowing semiconductor inspection.
- Optical Charge-Density Diagnostics for Noise-Sensitive Small Circuits
Photoluminescence from aligned defect sensor sites measures circuit charge density with lower noise and thermal impact in compact circuits.
- IO Driver Contactless Test Using On-Chip Voltage Comparison
On-chip voltage comparison enables contactless IO driver testing without probe-pad capacitance, preserving high-speed chip performance.
- CuA Optical Metrology Using CMOS Effective Medium Modeling
A multi-step effective medium model separates CMOS interference from memory array signals to improve CuA optical metrology accuracy.
- Dual-Sided Semiconductor Failure Analysis With Overlapping Irradiation
Dual-surface light scanning keeps a smaller irradiation region fully overlapped to improve semiconductor failure detection accuracy.
- Optical Engine DC BIST for Early Chip-to-Chip Connectivity Testing
DC BIST biases the photodiode electrically to verify IC connectivity before optical assembly, cutting test cost and component waste.
- Electron Beam Packaging Substrate Testing Without Contact Pad Damage
Electric-field-driven ions enable contactless electron beam testing of packaging substrates to detect shorts, opens, and leakages reliably.