Contactless Packaging Substrate Testing with Variable-Energy Electron Beams

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Solution Overview

Problem

Existing methods for testing packaging substrates, such as panel-level and advanced packaging substrates, face challenges in reliably and quickly identifying defects like shorts, opens, and leakages due to the miniaturization of components, which makes mechanical probing difficult and potentially damaging, and other test methods struggle with throughput and topography issues.

Innovation Solution

A contactless testing method using electron beams with varying landing energies to detect signal electrons for evaluating device-to-device electrical interconnect paths, allowing for accurate defect identification without physical contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contact probe is used to test contact pads, then electrical connection can be established for testing, but the device under test may be damaged and contacting reliability decreases due to miniaturization

Engineering Contradiction:

Improvecontacting reliabilityVSAvoiddamage to contact pads

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical contact probe system with a non-contact electrical field detection system. The testing apparatus uses electrical field detectors to sense electrical signals through the packaging substrate without making physical contact with the contact pads, thereby eliminating mechanical damage while maintaining testing capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an electrical field as an intermediary between the testing apparatus and the contact pads. The electrical field penetrates the packaging substrate to detect electrical connections without requiring direct contact with the miniaturized contact pads, solving both the damage and reliability issues

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If standard electrical-mechanical probing is used, then testing can be performed, but throughput decreases due to higher number of test points

Engineering Contradiction:

ImprovethroughputVSAvoidnumber of test points

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent makes the testing apparatus universal by enabling simultaneous detection of multiple electrical connections through the packaging substrate using electrical field detectors. This multi-functional capability allows testing of numerous interconnect paths in parallel, dramatically increasing throughput without requiring proportional increases in test points

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of operation

If capacitive detectors or electrical field detectors are used, then testing can be performed, but mechanical spacing requirements increase due to topography issues

Engineering Contradiction:

Improvetesting capabilityVSAvoidmechanical spacing

Core Design Contradiction:

Ease of operationVSLength of stationary object

Solution Approach 1:

The patent replaces mechanical measurement approaches with electrical field-based detection. The electrical field detectors can sense through the packaging substrate topography without being constrained by mechanical spacing requirements, allowing testing of complex three-dimensional interconnect structures

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables fast and reliable detection of defects in packaging substrates with high throughput, avoiding damage to small contact pads and accommodating complex topographies, suitable for advanced packaging substrates with numerous interconnect paths.

Implementation Method 1

directing an electron beam of the at least one electron beam column with a first landing energy on at least a first portion of the packaging substrate; directing the electron beam of the at least one electron beam column with a second landing energy different from the first landing energy on the packaging substrate

Methodology Applied

Scientific EffectElectron beam: Electron Beam

Implementation Method 2

detecting signal electrons emitted upon impingement of the electron beam for testing at least a first device-to-device electrical interconnect path of the packaging substrate

Methodology Applied

Scientific EffectElectron emission upon impingement: Electron Impact Desorption

Data Source

PatentUS20250216451A1Method and apparatus for testing a packaging substrate

Publication Date: 2025.07.03 APPLIED MATERIALS INC

AI summary

A method of testing a packaging substrate with at least one electron beam column is described. The packaging substrate is a panel level packaging substrate or an advanced packaging substrate. The method includes: placing the packaging substrate on a stage in a vacuum chamber; directing an electron beam of the at least one electron beam column with a first landing energy on at least a first portion of the packaging substrate; directing the electron beam of the at least one electron beam column with a second landing energy different from the first landing energy on the packaging substrate; and detecting signal electrons emitted upon impingement of the electron beam for testing at least a first device-to-device electrical interconnect path of the packaging substrate.