Wireless Probe Card for IC Die Defect Detection
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Solution Overview
Problem
Current methods for testing embedded wireless modules in integrated circuit dies are limited as they are typically conducted after packaging, making it difficult for manufacturers to identify and address defects before packaging, which can increase costs and reduce yield.
Innovation Solution
A wireless probe card is used to test integrated circuit dies by sending and receiving wireless signals, allowing for the determination of die defects before packaging through a housing with connectors, probes, and an antenna that can transmit and receive signals, enabling early defect identification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If testing is conducted after packaging, then packaging cost is reduced, but defect detection capability is worsened
Solution Approach 1:
The patent implements testing before packaging by integrating a wireless probe card into the packaging equipment. The probe card establishes wireless communication with the wireless module on the integrated circuit die prior to packaging, enabling defect detection at an earlier stage when defects can still be addressed cost-effectively.
2Reliability
If testing is conducted before packaging, then defect detection capability is improved, but device complexity is worsened
Solution Approach 1:
The packaging equipment is designed with multi-functionality by integrating both packaging capabilities and wireless testing capabilities into a single system. The probe card serves dual purposes: it facilitates wireless communication for testing while also being part of the packaging process, thereby reducing the need for separate dedicated testing equipment.
Solution Approach 2:
The wireless probe card acts as an intermediary between the packaging equipment and the integrated circuit die. It establishes wireless communication to enable testing without requiring direct physical contact or complex wired connections, simplifying the overall testing system architecture.
3Reliability
If wireless probe card is used, then defect detection capability is improved, but manufacturing time is worsened
Solution Approach 1:
The wireless testing process is integrated into the continuous packaging flow. The probe card establishes wireless communication and performs testing without interrupting the packaging process, allowing testing and packaging to occur in a continuous manner rather than as separate sequential steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the early detection of defective integrated circuit dies, enabling manufacturers to address issues before packaging, thereby improving yield and reducing manufacturing costs.
Implementation Method 1
an antenna configured to transmit a wireless signal to be received by at least one of the one or more integrated circuit dies, and/or to receive a wireless signal sent by at least one of the one or more integrated circuit dies
Data Source
AI summary
Disclosed is a probe card for testing a wireless module on an integrated circuit die contained on a wafer. The probe card includes a connector and a plurality of probes. The connector connects the probe card to test equipment. The plurality of probes connects the probe card to a wafer containing a plurality of integrated circuit dies. The probe card additionally includes an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies.