Optical Sensor Testing Wiring Circuit Abnormalities
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for detecting wiring abnormalities in complex circuit substrates are ineffective due to the large number of wirings, leading to inaccurate measurements and increased measurement time.
Innovation Solution
An apparatus and method utilizing an optical sensor with a patterned reflective layer and an electric field generator to detect electric fields emitted from the circuit substrate, allowing for non-contact testing and precise determination of wiring abnormalities by capturing signal and optical images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional methods are used to detect wiring abnormalities, then the testing process can be performed, but the measurement time increases and accuracy decreases due to the large number of wirings
Solution Approach 1:
The patent replaces conventional electrical measurement methods with an optical detection system. An optical sensor detects electric fields emitted from the circuit substrate through optical coupling, substituting traditional electrical probes and measurement equipment. This optical field-based detection enables simultaneous measurement of multiple wiring points, dramatically reducing measurement time while maintaining or improving detection accuracy.
Solution Approach 2:
The optical sensor serves multiple functions: it detects electric fields from multiple wiring points simultaneously, captures optical images of the substrate, and provides both quantitative measurement data and visual documentation. This multi-functionality eliminates the need for separate measurement and imaging systems, reducing overall measurement time while improving comprehensive detection accuracy.
2Reliability
If conventional electrical measurement methods are used, then wiring can be tested, but the complexity of the testing system increases due to the need for multiple sensors and identification markers
Solution Approach 1:
The patent extracts and eliminates unnecessary components from the testing system. By using optical detection of electric fields, it removes the need for physical contact with wiring points, eliminates identification markers that would clutter the substrate, and removes complex positioning sensors. This simplification reduces system complexity while maintaining testing reliability through non-contact optical field detection.
Solution Approach 2:
The optical sensor integrates multiple testing functions into a single device, simultaneously performing electric field detection, optical imaging, and position identification without requiring separate components. This multi-functional approach reduces the number of separate sensors and auxiliary devices needed, thereby reducing system complexity while improving reliability through consistent measurement capabilities.
3Device complexity
If a single light source is used for both signal and optical image capture, then the device complexity is reduced, but the measurement precision must be maintained
Solution Approach 1:
A single light source is designed to perform dual functions: illuminating the substrate for optical imaging and enabling electric field detection through optical coupling. The system uses wavelength separation or temporal multiplexing to distinguish between imaging light and detection signal, maintaining measurement precision while reducing device complexity by eliminating the need for separate light sources.
Solution Approach 2:
The patent introduces an optical coupling medium or wavelength filtering mechanism as an intermediary between the single light source and the detection system. This intermediary separates the imaging function from the signal detection function, allowing precise measurement of electric fields while using the same light source for both purposes, thereby maintaining precision without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and precise detection of wiring abnormalities in a non-contact manner, reducing measurement time and improving accuracy by using a single light source for both signal and optical image capture without the need for identification markers or position sensors.
Implementation Method 1
an optical sensor whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate
Implementation Method 2
a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate
Data Source
AI summary
An apparatus for testing a wiring circuit includes: a circuit substrate having wirings in the circuit substrate and pads on an upper surface of the circuit substrate and connected to the wirings; an electrode below a lower surface of the circuit substrate; an optical sensor above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit above the optical sensor and configured to irradiate light, wherein the optical sensor includes: an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region reflecting light incident on the optical substrate and a second region transmitting the light incident on the optical substrate.