Probe Card Wiring Substrate Segmentation for Misalignment Compensation
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Solution Overview
Problem
Existing electronic device testing systems face challenges in establishing reliable electrical connections between probes and terminals due to misorientation, which can lead to incomplete or unreliable test results.
Innovation Solution
The system employs a probe card assembly with a planarizing mechanism and a docking and adjustment assembly to adjust the orientation of probes, ensuring co-planarity with terminals, using actuators and reference structures to correct for misalignments and imperfections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid wiring substrate is used to provide stable electrical connections, then structural stability is improved, but the ability to accommodate misalignment and orientation errors between probes and terminals deteriorates
Solution Approach 1:
The wiring substrate is divided into multiple segments or sections that can move independently relative to each other. This segmentation allows the substrate to flex and accommodate misalignment between probes and terminals while maintaining overall structural stability for reliable electrical connections.
Solution Approach 2:
The wiring substrate transitions from a completely rigid structure to a dynamically adaptable structure with controlled flexibility. This allows the substrate to adjust its configuration to accommodate orientation errors and misalignment during probe card operation while maintaining stability for electrical connectivity.
2Adaptability or versatility
If the wiring substrate is made flexible to accommodate misalignment, then adaptability is improved, but structural stability and connection reliability deteriorate
Solution Approach 1:
Different regions of the wiring substrate have different mechanical properties. Areas requiring flexibility for alignment accommodation are made more compliant, while areas requiring stable electrical connections maintain rigidity. This local differentiation of mechanical properties resolves the contradiction between adaptability and stability.
Solution Approach 2:
The wiring substrate employs composite material construction combining rigid and flexible components. This allows the substrate to simultaneously provide structural stability for reliable electrical connections and flexibility for accommodating misalignment between probes and terminals.
3Strength
If mechanical coupling is maintained between wiring substrate sections for structural integrity, then strength is improved, but the ability to independently adjust probe orientation deteriorates
Solution Approach 1:
The wiring substrate is segmented into multiple independently adjustable sections while maintaining overall structural integrity through controlled mechanical coupling. This allows individual sections to be adjusted for probe orientation while the entire assembly maintains strength and stability.
Solution Approach 2:
The mechanical coupling between wiring substrate sections is designed to be dynamically adjustable, allowing for independent orientation adjustment during operation while maintaining structural integrity. This enables both strong structural coupling and flexible adjustment capability.
Data Source
AI summary
A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.