IC Handler Non-Contact Displacement Meter for Double Stacking Detection
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Solution Overview
Problem
Existing IC handlers face challenges in preventing double stacking of IC devices in test sockets without requiring extensive preparatory work, especially when the type of socket or IC device changes, as previous methods like fiber sensors and imaging devices are inaccurate and labor-intensive.
Innovation Solution
An IC handler equipped with a non-contact displacement meter that measures the distance from the meter to the IC device on the socket's placing surface using a beam, allowing for accurate detection of potential double stacking without the need for extensive adjustments or new reference data when the socket or IC device type changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fiber sensor is used to detect IC devices in sockets, then the detection function is provided, but the measurement precision deteriorates for thin IC devices and the device complexity increases due to precise positioning requirements
Solution Approach 1:
The patent replaces the optical fiber sensor system with a non-contact displacement meter that uses a beam (optical or electromagnetic) to measure distance. This substitution eliminates the mechanical positioning requirements of fiber sensors while maintaining detection capability, resolving the contradiction between detection reliability and measurement precision for thin IC devices.
Solution Approach 2:
The patent introduces a non-contact displacement meter as an intermediary device between the detection system and the IC device. This intermediary provides a reliable detection mechanism that does not require direct contact or precise positioning, thereby improving measurement precision while maintaining detection reliability.
2Reliability
If imaging devices are used to detect IC devices in sockets, then the detection function is provided, but the ease of operation deteriorates due to the need for adjusting light application and producing new reference data when socket or IC device type changes
Solution Approach 1:
The patent uses a non-contact displacement meter that measures distance based on beam reflection or emission. The measurement principle remains consistent across different socket and IC device types, eliminating the need to adjust light application parameters or produce new reference data. This resolves the contradiction between detection reliability and ease of operation by providing a universal measurement approach.
Solution Approach 2:
The non-contact displacement meter provides a universal detection method that works for various socket and IC device types without requiring type-specific calibration or adjustment. This multi-functionality resolves the contradiction by maintaining detection reliability across different applications while significantly improving ease of operation.
3Measurement precision
If fiber sensors are precisely positioned for each IC device type, then detection accuracy is improved, but the loss of time increases due to extensive preparatory work
Solution Approach 1:
The patent eliminates the need for preliminary positioning actions by using a non-contact displacement meter that does not require precise alignment. The device can accurately measure IC device positions without prior calibration or adjustment, thereby resolving the contradiction between detection accuracy and preparatory work time.
Solution Approach 2:
By replacing the fiber sensor system with a non-contact displacement meter, the patent eliminates the mechanical positioning steps that consume time during preparatory work. This substitution maintains detection accuracy while significantly reducing the time required for setup and calibration.
4Productivity
If the contact head pushes IC devices in sockets, then the testing process is completed, but the object-generated harmful factors increase due to potential damage to IC devices or contact head in double stacked states
Solution Approach 1:
The patent implements a detection system using a non-contact displacement meter that provides feedback about the position of IC devices in sockets. This feedback mechanism allows the system to detect potential double stacking conditions before the contact head operates, enabling preventive actions to avoid damage while maintaining testing productivity.
Solution Approach 2:
The detection system performs preliminary detection of IC device positions to prevent double stacking before it occurs. By identifying potential issues in advance, the system can take corrective action to prevent the harmful effects of double stacking, thereby protecting both IC devices and the contact head while maintaining operational efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable prevention of double stacking by using measured distances to assess the risk of IC devices being stacked, eliminating the need for massive preparatory work and ensuring accurate detection even with thin IC devices, thus improving operational efficiency.
Implementation Method 1
the non-contact displacement meter fires a beam toward the placing surface to thereby measure a distance from the non-contact displacement meter to the IC device placed on the placing surface
Data Source
AI summary
An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).