Electron Beam Packaging Substrate Testing Without Contact Pad Damage

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Solution Overview

Problem

Existing methods for testing packaging substrates, such as panel-level and advanced packaging substrates, face challenges in reliably and efficiently identifying defects like shorts, opens, and leakages due to the miniaturization of components, which complicates contact probing and reduces the effectiveness of electrical and mechanical testing.

Innovation Solution

A contactless testing method using electron beams is employed, where a packaging substrate is placed in a vacuum chamber, flooded with positive ions or negative charges, and an electric field accelerates these charges towards the substrate, enabling electron beam scanning for defect detection and classification.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If contact probes are used to test contact pads, then electrical connections can be directly measured, but the risk of damaging the device under test increases and testing becomes difficult due to miniaturization

Engineering Contradiction:

Improvedefect detection accuracyVSAvoiddamage risk to contact pads

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical contact probes with an electron beam-based testing system. The electron beam can be focused to very small spots to test individual contact pads and interconnects without physical contact, eliminating the risk of mechanical damage while maintaining high measurement precision through electrical field interaction with the test structures

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an electric field as an intermediary between the testing system and the contact pads. By applying voltage through electrodes to create electric fields that interact with the conductive structures being tested, the system can detect defects without direct mechanical contact, thus avoiding damage to the delicate contact pads

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the number of test points increases to meet volume production requirements, then throughput can be maintained, but contacting reliability decreases due to smaller contact size

Engineering Contradiction:

Improvetesting throughputVSAvoidcontacting reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The electron beam system replaces mechanical probing, allowing rapid scanning of numerous test points without the reliability issues of mechanical contact. The beam can be quickly repositioned and focused on each test point, maintaining high throughput while ensuring reliable electrical interaction regardless of contact pad size

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from two-dimensional contact pad surfaces to three-dimensional electric field interaction. By applying voltage through electrodes and detecting current flow through the substrate structures, the system can test interconnects and contact pads from multiple electrical perspectives, improving reliability across numerous test points

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of operation

If capacitive detectors or electric field detectors are used, then testing can be performed with small mechanical spacing, but the topography of packaging substrates creates difficulties

Engineering Contradiction:

Improvemechanical spacingVSAvoidtopography interference

Core Design Contradiction:

Ease of operationVSDifficulty of detecting and measuring

Solution Approach 1:

The patent replaces mechanical detectors with an electron beam system that can electronically adapt to substrate topography. The electron beam can be focused and scanned across uneven surfaces without physical contact, and the electrical field interaction remains effective regardless of surface variations, eliminating topography-related measurement difficulties

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for accurate and repeatable defect detection without damaging the substrate, providing high throughput and reliability in identifying defects like shorts, opens, and leakages, even on small contact pads.

Implementation Method 1

testing the packaging substrate in the vacuum chamber with at least one electron beam column

Methodology Applied

Scientific EffectElectron beam: Electron Beam

Implementation Method 2

generating an electric field between one or more electrodes and the packaging substrate, the electric field being configured to accelerate the positive ions or the negative charges towards the substrate

Methodology Applied

Scientific EffectElectric field: Electric Field

Data Source

PatentUS20250362342A1Method for testing a packaging substrate, and apparatus for testing a packaging substrate

Publication Date: 2025.11.27 APPLIED MATERIALS INC

AI summary

A method for testing a packaging substrate with at least one electron beam column is described. The packaging substrate is a panel level packaging substrate or an advanced packaging substrate. The method includes placing the packaging substrate on a stage in a vacuum chamber; flooding at least portions of the vacuum chamber with positive ions and/or negative charges; generating an electric field between one or more electrodes and the packaging substrate, the electric field being configured to accelerate the positive ions or the negative charges towards the substrate; and testing the packaging substrate in the vacuum chamber with at least one electron beam column.