Capacitive Chip-to-Chip-Carrier Connection Fault Detection
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Solution Overview
Problem
Current methods for detecting defects in chip-to-chip-carrier connections, such as bond wire faults and leadframe anomalies, are either too complex and expensive for widespread application or lack the sensitivity to identify low-quality connections, leading to potential short circuits and quality issues that are only recognized during final testing.
Innovation Solution
An automated measuring device that uses a capacitive measurement system with a detection portion including a plate and detection circuit to detect electrical signals from the chip, chip-carrier, and chip-to-chip-carrier connections, allowing for precise measurement of capacitance deviations indicative of connection faults, enabling early identification of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical x-ray controller is used to test the entire chip, then measurement precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent replaces complex optical x-ray measurement systems with a simple electrical measurement system. Instead of using optical controllers and x-ray equipment to detect physical anomalies, the invention uses electrical signals and impedance measurements to detect connection quality, thereby eliminating the need for expensive and complex optical measurement equipment while achieving comparable or superior detection sensitivity.
Solution Approach 2:
The patent introduces an intermediary measurement approach by using electrical signals as a mediator to indirectly assess connection quality. Rather than directly observing physical connection states with complex optical equipment, the system uses electrical impedance measurements as an intermediary indicator that reflects the quality of chip-to-chip-carrier connections, simplifying the overall measurement system.
2Measurement precision
If optical x-ray controller is used to test the entire chip, then measurement precision is improved, but productivity decreases
Solution Approach 1:
The patent replaces time-consuming optical x-ray scanning with rapid electrical measurements. The electrical impedance measurement can be performed quickly without the mechanical scanning and image processing required by optical systems, thereby significantly improving testing speed and productivity while maintaining detection precision.
Solution Approach 2:
The patent employs periodic electrical signal stimulation to efficiently measure multiple connection points. By using periodic signals and multiplexing techniques, the system can rapidly cycle through measurements of multiple chips and connection points, achieving high throughput without sacrificing measurement accuracy.
3Device complexity
If conventional testing methods are used, then device complexity is reduced, but measurement precision deteriorates
Solution Approach 1:
The patent changes the measurement parameter from physical observation (optical/x-ray) to electrical property measurement (impedance, capacitance, inductance). This parameter change enables simple electrical circuits to achieve precise detection of connection quality, as electrical measurements are inherently more sensitive to subtle connection variations than optical methods.
Solution Approach 2:
The patent creates an electrical model (copy) of the physical connection structure. By measuring electrical parameters, the system creates an indirect representation of the physical connection state, allowing simple electrical measurements to reveal detailed information about connection quality that would require complex physical inspection methods.
4Device complexity
If conventional testing at fixed measuring points is used, then device complexity is reduced, but measurement precision deteriorates
Solution Approach 1:
The patent creates a universal measurement system that can detect multiple types of connection faults through a single electrical measurement approach. The same simple electrical circuit can detect various anomalies including poor soldering, wire bond issues, and internal connection defects, eliminating the need for multiple specialized measurement systems while achieving comprehensive fault detection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the accurate and efficient detection of defects in chip-to-chip-carrier connections, improving the quality of semiconductor devices by identifying anomalies before they reach the end consumer, thereby reducing the risk of short circuits and enhancing production quality.
Implementation Method 1
an automated measuring device that uses a capacitive measurement system with a detection portion including a plate and detection circuit to detect electrical signals from the chip, chip-carrier, and chip-to-chip-carrier connections
Data Source
AI summary
A measuring device is provided: the measuring device including: a power supply configured to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement including a chip and a chip-carrier connected to the chip via one or more chip-to-chip-carrier connections; a detection portion including a plate; a detection circuit coupled to the plate and configured to detect an electrical signal from the plate; wherein the plate is configured such that it covers at least part of at least one of the chip, the chip-carrier, and the chip-to-chip-carrier connection; and wherein the plate is further configured such that at least part of the at least one of the chip, the chip-carrier, and the chip-to-chip-carrier connection is uncovered by the plate.