Capacitive Device Insulation Film Bonding
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Solution Overview
Problem
Existing methods for manufacturing capacitive electrical devices with jointed films often result in inhomogeneities and voids due to overlapping insulation layers, which reduce dielectric strength and require time-consuming impregnation processes, increasing manufacturing costs.
Innovation Solution
Bonding two electrical insulation films before winding them around a shaft to create a single film with uniform thickness, eliminating the need for post-processing and impregnation, thereby forming a capacitive electrical device with enhanced dielectric properties and reduced manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If films are joined by winding with overlap, then the insulation width requirement is met, but inhomogeneities and voids are created reducing dielectric strength
Solution Approach 1:
The films are joined together before the winding process, creating a seamless bonded film that eliminates overlap-related inhomogeneities and voids. This preliminary bonding action prevents dielectric weaknesses before they can affect the final product reliability.
2Reliability
If impregnation process is used to fill cavities, then dielectric strength is improved, but manufacturing time and costs increase substantially
Solution Approach 1:
The films are bonded together before winding, preventing cavity formation in the first place. This eliminates the need for subsequent impregnation processes to fill voids, thereby substantially reducing manufacturing time and costs while maintaining dielectric strength.
Solution Approach 2:
The bonding process converts the potential harm of film joints into a benefit by creating a seamless structure that eliminates voids, making impregnation unnecessary and turning a previously harmful defect-prone process into a beneficial void-free construction method.
3Area of stationary object
If lap joint is used to join films, then width requirement is satisfied, but homogeneous condenser core cannot be made
Solution Approach 1:
The films are bonded together in a controlled preliminary step before winding, ensuring precise alignment and seamless joining. This preliminary bonding action achieves both the required width and homogeneous structure, eliminating the inhomogeneities inherent in lap joint methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces capacitive electrical devices with uniform dielectric properties and reduced risk of voids, enhancing dielectric withstand strength and simplifying the manufacturing process by eliminating the need for impregnation, thus lowering costs and improving reliability.
Implementation Method 1
bonding a first electrical insulation film with a second electrical insulation film to obtain a single electrical insulation film
Data Source
Figure 1a~1c
Figure 2a~2c
Figure 3
AI summary
The present disclosure relates to a method of manufacturing a capacitive electrical device. The method comprises a) bonding a first electrical insulation film with a second electrical insulation film to obtain a single electrical insulation film that has a larger surface area than any of the first electrical insulation film and the second electrical insulation film has alone, b) providing a conductive layer onto the single electrical insulation film, and c) winding the single electrical insulation film and the conductive layer around a shaft to obtain a layer of the single electrical insulation film and a layer of the conductive layer wound onto the shaft, thereby forming the capacitive electrical device.