An asymmetric metal frame lowers the center of gravity to prevent toppling, reducing acoustic noise and equivalent series resistance.
Outer electrodes connect to both ends of the cylindrical part, enabling linear current flow along the central axis to reduce equivalent series resistance.
Ceramic-metal compound layers at electrode interfaces increase permittivity while preventing crack propagation to resolve reliability-strength trade-offs.
A Cu-Ni alloy layer with a Sn-containing surface forms an intermetallic compound on electronic part electrodes.
A multilayer capacitor structure uses alternating conductive line levels connected by vias to increase capacitance density in deep sub-micron CMOS.
Composite external electrodes with ceramic grains and glass suppress stress during cofiring to prevent cracks in multilayer ceramic devices.
Extending internal electrodes to lateral surfaces allows reliable plating deposition, maintaining capacitor strength during thickness reduction.
Dimensional expansion and segmentation of inner electrodes reduce direct-current resistance while maintaining mechanical strength despite lower capacitance.
Heat treatment at low oxygen pressure induces counter diffusion to seal voids and prevent moisture contamination in multilayer electronic components.
Non-uniform bus widths in metal finger capacitors lower effective resistance, boosting quality factor Q by 15% to 35% without sacrificing capacitance density.
A laminated ceramic component external electrode uses a Cu3Sn alloy conducting layer to bond internal nickel electrodes.
Optimizing polyvinyl butyral content prevents crack generation from thermal shock while maintaining electrode connectivity.
A quadruple-layer interposer absorbs piezoelectric vibrations in multilayer capacitors, reducing substrate noise transmission and improving bending strength.
A four-terminal carbon nanotube capacitor switches its dielectric film between conductive and insulating states using distinct voltage signals.
Segmented external electrodes with organic interlayers prevent crack propagation in ceramic bodies by absorbing warping stress via delamination.
Alternating dielectric layers and internal electrodes accumulate charge within a compact multilayer capacitor body to boost capacitance density.
A multilayer capacitor uses an asymmetric outer layer structure to increase distance between the capacitance generating portion and the mounting substrate.
A multilayer ceramic device uses precise dimensional ratios to maintain capacitance in ultra-thin dielectric layers.
Vacuum-deposited polymer dielectric layers maintain stable dissipation factor and self-healing properties despite high operating temperatures.