Conductive Paste for MLCC Internal Electrodes
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with crack generation due to internal stress caused by thermal shock during the firing or mounting process, especially as the components become thinner and more complex, affecting electrode connectivity and electrical characteristics.
Innovation Solution
A conductive paste for internal electrodes in multilayer ceramic components is developed, comprising 100 parts by weight of conductive metal powder and 0.6 to 2.4 parts by weight of polyvinyl butyral as an organic binder, with an average particle size of 50 nm to 400 nm, and optionally including a cellulose-based resin like ethyl cellulose to reduce internal stress and enhance printing characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If internal electrodes are formed by printing paste onto ceramic green sheets with better leveling characteristics, then electrode connectivity is increased, but internal stress is generated due to thermal shock during firing or mounting, causing crack generation
Solution Approach 1:
The patent changes the chemical composition parameters of the conductive paste by incorporating specific glass particles (with SiO2 content of 40-70 wt%) and controlling the organic binder content (0.6-2.4 parts by weight per 100 parts conductive metal powder). These parameter changes modify the paste's thermal properties to reduce thermal shock during firing, thereby preventing crack generation while maintaining electrode connectivity
Solution Approach 2:
The patent uses a composite material system consisting of conductive metal powder (Ag, Pb, Pt, Ni, or Cu), organic binder (polyvinyl butyral), and glass particles (containing SiO2, B2O3, Al2O3). This composite formulation combines materials with complementary properties: the metal provides conductivity, the binder provides binding and stress relief, and the glass particles provide thermal shock resistance, collectively solving both connectivity and crack prevention requirements
2Productivity
If dielectric layers are made thinner to achieve high capacity, then layer thickness ratio changes, but internal stress increases during thermal processing, leading to crack generation
Solution Approach 1:
The patent modifies the thermal properties of the conductive paste by adjusting glass particle content (1-10 parts by weight per 100 parts conductive metal powder) and composition, enabling the paste to withstand thermal shock during firing of thinner dielectric layers. This allows high-capacity components with reduced layer thickness to be manufactured without crack generation
Data Source
AI summary
A conductive paste for an internal electrode of a multilayer ceramic electronic component capable of restraining a generation of cracks by reducing internal stress, and a multilayer ceramic electronic component fabricated by using the same are provided. The conductive paste for an internal electrode of a multilayer ceramic electronic component includes: 100 parts by weight of a conductive metal powder; and 0.6 to 2.4 parts by weight of an organic binder. The use of the conductive paste can reduce internal stress of a multilayer ceramic electronic component, thus restraining a generation of cracks therein in the multilayer ceramic electronic component.