Multilayer Ceramic Component Organic Layer Stress Dispersion
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Solution Overview
Problem
Multilayer ceramic electronic components face reliability issues due to stress propagation from substrate warping, leading to cracks and deformations, which existing solutions inadequately address.
Innovation Solution
The use of a multilayer ceramic electronic component design featuring external electrodes with a conductive metal and glass base electrode layer, an organic silicon compound layer, and a plating layer, where the adhesion strength between the laminated body and the base electrode layer is higher than between the organic and plating layers, dispersing stress through delamination and preventing crack propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external electrodes are joined to the principal surfaces of the ceramic body, then the electrical connection is ensured, but the stress propagates to the ceramic body causing cracks
Solution Approach 1:
The external electrode is divided into multiple layers: a base electrode layer joined to the ceramic body, and a wraparound portion that extends around the edges. This segmentation allows the electrode to fulfill both electrical connection and stress mitigation functions simultaneously.
Solution Approach 2:
The wraparound portion of the external electrode acts as an intermediary element that absorbs and disperses stress away from the ceramic body, preventing direct stress transmission while maintaining electrical connectivity through the base electrode layer.
2Reliability
If the wraparound portions are provided with leading-end spaced portions, then crack prevention is improved, but the stress propagation through base end-side joint portions remains a concern
Solution Approach 1:
The patent applies different structural characteristics to different portions of the external electrode: the base electrode layer provides stable electrical connection at the joint portions, while the wraparound portions provide stress absorption. This local differentiation optimizes both connection reliability and stress resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces or prevents cracking and deformation in ceramic and internal electrode portions, enhancing the reliability and performance of multilayer ceramic components by dispersing stress and maintaining adhesion between layers.
Implementation Method 1
the adhesion strength between the laminated body and the base electrode layer is higher than between the organic and plating layers, dispersing stress through delamination and preventing crack propagation
Data Source
AI summary
In a multilayer ceramic electronic component, a first organic layer covers from a first base electrode layer to at least a portion of the surface of a laminated body, and a second organic layer covers from a second base electrode layer to at least a portion of the surface of the laminated body, and a first plating layer includes a leading end in contact with the first organic layer, with the first organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the first base electrode layer, and a second plating layer has a leading end in contact with the second organic layer, with the second organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the second base electrode layer.