Multilayer Ceramic Component With Ceramic-Metal Compound Layers
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Solution Overview
Problem
Current multilayer ceramic electronic components face limitations in achieving high permittivity and reliability, primarily due to the need for further improvement in electrical properties beyond composition and thickness changes of dielectric materials and internal electrode patterns.
Innovation Solution
The integration of ceramic-metal compound layers on interfaces between internal electrodes and dielectric layers, along with the use of metal nano-particles in central portions of dielectric layers, enhances permittivity and reliability by creating a space charge effect and energy barrier, preventing crack propagation and increasing insulation resistance and breakdown voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric material composition and thickness are changed to improve permittivity, then electrical properties improve, but reliability and mechanical integrity deteriorate
Solution Approach 1:
The patent applies local quality by introducing ceramic-metal compound layers specifically at the interfaces between internal electrodes and dielectric layers, and placing metal nanoparticles in central portions of dielectric layers. This localized enhancement of specific regions (interfaces and centers) improves permittivity and electrical properties without requiring changes to the overall dielectric material composition or thickness, thereby maintaining mechanical integrity.
Solution Approach 2:
The patent employs composite materials by combining ceramic dielectric layers with metal-containing ceramic-metal compound layers and metal nanoparticles. This composite structure creates a multi-phase material system where the ceramic matrix provides mechanical strength while the metal phases enhance permittivity through space charge effects, resolving the contradiction between electrical performance and mechanical integrity.
2Volume of moving object
If dielectric layer thickness is reduced to achieve thin multilayer components, then miniaturization is achieved, but permittivity and reliability decrease
Solution Approach 1:
The patent maintains thin overall component dimensions while locally enhancing permittivity at critical positions. By concentrating metal-containing phases at interfaces and in central portions of dielectric layers, the invention achieves high permittivity in a compact volume, allowing miniaturization without sacrificing electrical performance.
Solution Approach 2:
The patent changes the physical and chemical parameters of the dielectric structure by incorporating metal phases with different permittivity values. The metal nanoparticles and ceramic-metal compound layers create regions of high permittivity that compensate for the reduced overall dielectric layer thickness, maintaining electrical properties despite miniaturization.
3Reliability
If conventional dielectric materials are used to maintain simplicity, then manufacturing is easier, but permittivity and electrical properties are insufficient
Solution Approach 1:
The patent uses composite ceramic-metal materials that combine the beneficial properties of both ceramic dielectrics (mechanical strength, insulation) and metals (high permittivity, space charge effect). This composite approach enhances electrical properties while maintaining a relatively simple layered structure that can be integrated into conventional multilayer ceramic component manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases permittivity, insulation resistance, and breakdown voltage, while maintaining mechanical integrity and preventing crack propagation, thereby enhancing the overall performance of multilayer ceramic electronic components.
Implementation Method 1
enhances permittivity and reliability by creating a space charge effect and energy barrier
Implementation Method 2
Metal nano-particles are disposed in central portions of the dielectric layers
Implementation Method 3
preventing crack propagation and increasing insulation resistance and breakdown voltage
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.