Multilayer Capacitor Interposer Damping Acoustic Noise

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Solution Overview

Problem

Multilayer capacitors generate acoustic noise due to vibrations caused by piezoelectric effects, leading to listener discomfort during device mounting, as these vibrations are transmitted to the substrate through solder connections.

Innovation Solution

The electronic component incorporates a multilayer capacitor with an interposer having quadruple-layer external terminals (CuNi, Cu, Ni, and Sn) and conductive adhesives to absorb vibrations, reducing noise transmission to the substrate and enhancing bending strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a multilayer capacitor is mounted on a substrate using solder connections, then electrical connectivity is achieved, but vibrations are transmitted to the substrate causing acoustic noise

Engineering Contradiction:

Improveelectrical connectivityVSAvoidacoustic noise

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent introduces an interposer as an intermediary component between the multilayer capacitor and the substrate. This interposer includes a damping layer that absorbs vibrations generated by the piezoelectric effect in the capacitor, preventing vibration transmission to the substrate while maintaining electrical connectivity through conductive adhesive layers.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the harmful vibrations generated by the piezoelectric effect into beneficial damping energy. The damping layer is specifically designed to absorb and dissipate the vibrational energy through material damping mechanisms, transforming the harmful acoustic noise into heat energy that is safely dissipated.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Volume of moving object

If the capacitor body is made compact for small size, then space efficiency improves, but bending strength decreases

Engineering Contradiction:

Improvecapacitor body sizeVSAvoidbending strength

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent employs composite material structures in the interposer assembly, combining ceramic capacitor bodies with polymer-based damping layers and metallic conductive adhesives. This composite structure allows the compact capacitor to achieve enhanced bending strength through the synergistic properties of different materials while maintaining its small size.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent addresses the bending strength issue by adding structural reinforcement in the vertical dimension through the interposer assembly. The damping layer and conductive adhesive layers create a multi-layered structure that increases moment of inertia and provides additional structural support, compensating for the reduced bending strength caused by compact horizontal dimensions.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces acoustic noise and improves the bending strength of the electronic component by absorbing vibrations through the interposer's quadruple-layer structure, ensuring stable mounting and minimizing noise generation.

Implementation Method 1

since the dielectric layer has piezoelectric properties through using a ferroelectric material, a piezoelectric phenomenon occurs between internal electrodes when a direct current or alternating current is applied to the multilayer capacitor, thereby expanding and contracting the volume of a capacitor body depending on frequency and generating periodic vibrations

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

a interposer disposed on a first surface side of the multilayer capacitor in the first direction, the interposer including an interposer body and first and second external terminals disposed on both ends of the interposer body in the second direction

Methodology Applied

Scientific EffectVibration absorption: Damping

Data Source

PatentUS11276528B2Electronic component

Publication Date: 2022.03.15 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.