Multilayer Electronic Component Plating Film Heat Treatment
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Solution Overview
Problem
Existing multilayer electronic components face issues with solder wettability and contamination due to the thickness of paste electrode films, which reduces electrostatic capacity and lifespan under high-temperature and high-humidity conditions.
Innovation Solution
A method involving the formation of a continuous plating film on internal electrodes, followed by heat treatment at low oxygen partial pressure and high temperature, resulting in counter diffusion that seals voids and prevents moisture and contaminants from entering the laminate, using metals like Ni, Cu, or Ag for internal and plating films with different primary components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If paste electrode films are used to form external electrodes, then solder wettability is ensured, but the thickness of paste electrode films reduces the effective volume for electrostatic capacity
Solution Approach 1:
The patent changes the thickness parameter of the electrode structure by replacing the thick paste electrode film (several tens to hundreds of micrometers) with thin plating films (several micrometers), thereby increasing the effective volume for electrostatic capacity while maintaining the external electrode function
Solution Approach 2:
The patent uses composite plating film structures (first plating film with Ni or other suitable material, and second plating film with Sn or other suitable material) to achieve both solder wettability and reduced thickness, combining the benefits of different materials in a layered configuration
2Ease of manufacture
If electroless plating is used to deposit conductive metal layer on internal electrodes, then external electrodes can be formed directly, but bonding between internal electrodes and plating film is insufficient allowing moisture and contaminants to enter
Solution Approach 1:
The patent applies preliminary action by forming a specific paste electrode film structure before plating that promotes strong bonding, and by controlling firing conditions in advance to ensure proper adhesion between the internal electrodes and plating films, preventing future contamination
Solution Approach 2:
The patent introduces an intermediary mechanism through the paste electrode film that facilitates strong bonding between the internal electrodes and plating films, acting as a bonding promoter that prevents moisture and contaminant penetration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances solder wettability, prevents contamination, and significantly improves sealing properties, extending the lifespan of multilayer electronic components under testing conditions.
Implementation Method 1
a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits
Implementation Method 2
a heat treatment step of performing a heat treatment on the laminate provided with the plating film at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more
Implementation Method 3
performing plating growth of the plating deposits so as to be connected to each other, and a heat treatment step of performing a heat treatment on the laminate provided with the plating film at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more
Data Source
AI summary
A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.