Capacitive Plasma Source With Segmented Gas Channels
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Solution Overview
Problem
Conventional plasma sources are incompatible with deposition processes that require separate and independent provision of process gases, such as cyclical deposition processes like atomic layer deposition (ALD), due to gas mixing prior to distribution into the process chamber.
Innovation Solution
An apparatus is designed with a capacitively coupled plasma source that includes multiple ground plates, insulators, and gas channels to allow separate and independent delivery of gases to the process chamber, preventing direct contact and mixing of gases, and utilizing power supplies to ignite gases into plasma within the plasma source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional plasma sources mix process gases prior to distribution, then the plasma source structure is simplified, but the compatibility with deposition processes requiring separate gas delivery (such as ALD) is lost
Solution Approach 1:
The plasma source is segmented into multiple independent gas delivery channels (first channel, second channel) that remain separate throughout the structure. Each channel has its own gas inlet and can deliver different process gases independently to the processing chamber, enabling compatibility with deposition processes like ALD that require separate gas delivery.
Solution Approach 2:
Different regions of the plasma source are assigned different functions: the first channel region handles one process gas while the second channel region handles another process gas. This local differentiation allows each channel to maintain its gas identity throughout the plasma source structure without mixing.
2Adaptability or versatility
If multiple ground plates and insulators are added to enable separate gas delivery, then gas delivery independence is achieved, but the device complexity increases
Solution Approach 1:
The ground plates serve multiple functions simultaneously: they provide electrical grounding, structural support for the channel system, and define the physical boundaries of the plasma generation region. The insulators similarly provide both electrical isolation and structural positioning functions, reducing the need for separate component types.
Solution Approach 2:
The gas channels are nested within the structure formed by the ground plates and insulators. The first and second channels are positioned between the electrode assembly and the processing chamber, with the ground plates and insulators forming concentric layers that house both channels while maintaining their independence.
3Reliability
If the electrode is isolated from ground plates by insulators, then electrical isolation is achieved, but the structural compactness is reduced
Solution Approach 1:
The insulators act as intermediary elements between the electrode and ground plates, providing the necessary electrical isolation while maintaining a compact structure. These insulators are strategically positioned at critical points where electrical isolation is needed, rather than requiring extensive spacing throughout the entire assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the separate and independent provision of gases to the process chamber, facilitating the use of the plasma source in deposition processes that require independent gas delivery, such as ALD, while reducing plasma-induced damage and ensuring uniform plasma distribution.
Implementation Method 1
an electrical insulator disposed between the electrode and the first ground plate to prevent direct contact between the electrode and the first ground plate
Implementation Method 2
an apparatus is designed with a capacitively coupled plasma source that includes multiple ground plates, insulators, and gas channels to allow separate and independent delivery of gases to the process chamber
Data Source
AI summary
Apparatus for providing plasma to a process chamber may include an electrode; a first ground plate disposed beneath the electrode defining a cavity therebetween; an insulator disposed between the electrode and first ground plate to prevent direct contact therebetween; a second ground plate disposed beneath the first ground plate defining a first channel; a plurality of first through holes through the first ground plate to fluidly couple the channel and cavity; a first gas inlet coupled to the first channel; a third ground plate disposed beneath the second ground plate defining a second channel; a plurality of conduits through the ground plates to fluidly couple the cavity to an area beneath the third ground plate; a plurality of gas outlet holes through the third ground plate to fluidly couple the second channel to the area beneath the third ground plate; and a second gas inlet coupled to the second channel.