Capacitor Array Package Structure for Mounting Flatness Accuracy

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Solution Overview

Problem

Existing multilayer capacitor arrays face challenges in maintaining stability and locational accuracy when mounted on a board due to the weight and deformation caused by metal frames, which can lead to distorted flatness of the encapsulating resin and reduced positional accuracy.

Innovation Solution

The proposed solution involves a metal frame structure with a capacitor array that includes multiple multilayer capacitors stacked in various directions, supported by first and second metal frames with protrusions and connection portions. The capacitor array is encapsulated with a resin material, and multiple protruding portions are formed on the lower surface of the capsule portion to enhance stability and prevent distortion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal frame is applied to support a capacitor array, then the capacitor array becomes more stable and resistant to vibrations, but the overall weight increases and the metal frame may not stably support the capacitor array

Engineering Contradiction:
Improvevibration resistanceVSAvoidweight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent combines metal frames with resin materials to create a composite support structure. The metal frame provides mechanical strength and vibration resistance, while the resin material reduces overall weight and provides additional damping. This composite approach resolves the contradiction by achieving both light weight and high vibration resistance through material combination.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If only one protruding portion is formed on the lower surface of the exterior resin material, then the structure is simple, but the flatness of the capsule portion is distorted reducing locational accuracy

Engineering Contradiction:
Improvestructure complexityVSAvoidlocational accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent divides the single protruding portion into multiple protruding portions (first protruding portion and second protruding portion) spaced at predetermined intervals. This segmentation distributes the support load across multiple points, preventing distortion of the capsule portion's flatness and maintaining locational accuracy when the component is mounted on a board.

Inventive Principle:
Principle #1Segmentation

3Quantity of substance

If multiple multilayer capacitors are stacked to increase capacity, then the product capacity increases, but the capacitor array becomes heavier and harder to support stably

Engineering Contradiction:
ImprovecapacityVSAvoidsupport stability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent uses a composite structure combining metal frames with resin materials to support the stacked capacitor array. The metal frame provides the necessary mechanical strength to support the increased weight of multiple capacitors, while the resin material reduces overall weight and provides damping. This composite approach enables stable support of high-capacity arrays without compromising reliability.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12322557B2Electronic component and board having the same mounted thereon
Publication Date: 2025.06.03 SAMSUNG ELECTRO MECHANICS CO LTD
  • US12322557B2 patent drawing
  • US12322557B2 patent drawing
  • US12322557B2 patent drawing

AI summary

An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.